TSI568A-10GILY datasheet, PDF - EEWORLD Datasheet

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TSI568A-10GILY: DescriptionTelecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675; CategoryWireless rf/communication Telecom circuit; File Size909KB，78 Pages; ManufacturerTundra Semiconductor Corp; Environmental Compliance

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TSI568A-10GILY Overview

Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675

TSI568A-10GILY Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	BGA,
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B675
JESD-609 code	e1
length	27 mm
Humidity sensitivity level	4
Number of functions	1
Number of terminals	675
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.66 mm
Nominal supply voltage	1.2 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
Base Number Matches	1

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Title

Tsi568A Serial RapidIO Switch

Hardware Manual

Formal

April 2007

80B8000_MA002_04

Trademarks

TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S., and U.K.). TUNDRA,

the Tundra logo, Tsi568A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor

Corporation. All other registered and unregistered marks (including trademarks, service marks and logos) are the

property of their respective owners. The absence of a mark identifier is not a representation that a particular

product name is not a mark.

Published in Canada

This document contains information that is proprietary to Tundra and may be used for non-commercial purposes

within your organization in support of Tundra products. No other use or transmission of all or any part of this

document is permitted without written permission from Tundra, and must include all copyright and other

proprietary notices. Use or transmission of all or any part of this document in violation of any applicable

Canadian or other legislation is hereby expressly prohibited.

User obtains no rights in the information or in any product, process, technology or trademark which it includes or

describes, and is expressly prohibited from modifying the information or creating derivative works without the

express written consent of Tundra.

Disclaimer

Tundra assumes no responsibility for the accuracy or completeness of the information presented, which is subject

to change without notice. Tundra products may contain design defects or errors known as errata which may cause

the product to deviate from published specifications. Current characterized errata are available on request. In no

event will Tundra be liable for any direct, indirect, special, incidental or consequential damages, including lost

profits, lost business or lost data, resulting from the use of or reliance upon the information, whether or not

Tundra has been advised of the possibility of such damages. The information contained in this document does

not affect or change Tundra’s product warranties.

Mention of non-Tundra products or services is for information purposes only and constitutes neither an

endorsement nor a recommendation.

As this information will change over time, please ensure you have the most recent version by contacting a

member of the Tundra technical support team, or by checking the Support section of www.tundra.com.

Corporate Profile

About Tundra

Tundra Semiconductor Corporation is the global leader in System Interconnect providing world-class

support and leading edge semiconductor solutions to the world’s foremost communications,

networking, storage system, and information technology vendors. Consistently delivering on

system-level performance promises that reduce time to market, Tundra System Interconnect ensures

market advantage in wireless infrastructure, storage networking, network access, military, industrial

automation, and information technology applications. Tundra headquarters are located in Ottawa,

Ontario, Canada. The Company also has a design center in South Portland, Maine, and sales offices

through out Europe, across the US and in Asia. Tundra sells its products worldwide through a network

of direct sales personnel, independent distributors, and manufacturers' representatives.

Tundra System Interconnect

Tundra uses the term

System Interconnect

to refer to the technology used to connect all the components

and sub-systems in almost any embedded system. This concept applies to the interfacing of functional

elements (CPU, memory, I/O complexes) within a single-board system, and the interconnection of

multiple boards in a larger system.

Advanced communications networks need advanced System Interconnect. It is a vital enabling

technology for the networked world. Tundra System Interconnect provides the latest interface and

throughput features, which enable communications infrastructure vendors to design and build more

powerful, faster equipment in shorter timeframes.

Tundra System Interconnect — vital to building the communications systems of the future:

•

Tundra System Interconnect products enable customers to get the performance, scalability, and

reliability from their systems to meet today's and tomorrow's bandwidth demands.

Tundra System Interconnect products are standards-based, off-the-shelf products that help

customers speed their time to market.

Tundra System Interconnect products meet the growing customer demand for outsourced

standards-based interconnect products.

Partnerships

Fundamental to the success of Tundra is its partnerships with leading technology companies, including

IBM, Intel, and Freescale. As a result of these alliances, Tundra devices complement our partners’

products, and greatly influence the design of customers’ architecture. Customers are changing their

designs to incorporate Tundra products. This is evidence of our commitment to be a significant part of

its customers’ success.

Tundra Semiconductor Corporation

www.tundra.com

Tsi568A Hardware Manual

80B8000_MA002_04

TSI568A-10GILY Related Products

	TSI568A-10GILY	TSI568A-10GCLY	TSI568A-10GCL	TSI568A-10GIL
Description	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675
Is it Rohs certified?	conform to	conform to	incompatible	incompatible
package instruction	BGA,	27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	27 X 27 MM, 1 MM PITCH, FCBGA-675	27 X 27 MM, 1 MM PITCH, FCBGA-675
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PBGA-B675	S-PBGA-B675	S-PBGA-B675	S-PBGA-B675
JESD-609 code	e1	e1	e0	e0
length	27 mm	27 mm	27 mm	27 mm
Humidity sensitivity level	4	4	4	4
Number of functions	1	1	1	1
Number of terminals	675	675	675	675
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.66 mm	2.66 mm	2.66 mm	2.66 mm
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm
Base Number Matches	1	1	1	1

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