TSI568A-10GCL datasheet, PDF - EEWORLD Datasheet

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TSI568A-10GCL: DescriptionTelecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675; CategoryWireless rf/communication Telecom circuit; File Size909KB，78 Pages; ManufacturerTundra Semiconductor Corp

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TSI568A-10GCL Overview

Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675

TSI568A-10GCL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	27 X 27 MM, 1 MM PITCH, FCBGA-675
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B675
JESD-609 code	e0
length	27 mm
Humidity sensitivity level	4
Number of functions	1
Number of terminals	675
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.66 mm
Nominal supply voltage	1.2 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
Base Number Matches	1

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Title

Tsi568A Serial RapidIO Switch

Hardware Manual

Formal

April 2007

80B8000_MA002_04

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TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S., and U.K.). TUNDRA,

the Tundra logo, Tsi568A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor

Corporation. All other registered and unregistered marks (including trademarks, service marks and logos) are the

property of their respective owners. The absence of a mark identifier is not a representation that a particular

product name is not a mark.

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Corporate Profile

About Tundra

Tundra Semiconductor Corporation is the global leader in System Interconnect providing world-class

support and leading edge semiconductor solutions to the world’s foremost communications,

networking, storage system, and information technology vendors. Consistently delivering on

system-level performance promises that reduce time to market, Tundra System Interconnect ensures

market advantage in wireless infrastructure, storage networking, network access, military, industrial

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Advanced communications networks need advanced System Interconnect. It is a vital enabling

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Tundra System Interconnect — vital to building the communications systems of the future:

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Tundra Semiconductor Corporation

www.tundra.com

Tsi568A Hardware Manual

80B8000_MA002_04

TSI568A-10GCL Related Products

	TSI568A-10GCL	TSI568A-10GCLY	TSI568A-10GILY	TSI568A-10GIL
Description	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	Telecom Circuit, 1-Func, PBGA675, 27 X 27 MM, 1 MM PITCH, FCBGA-675
Is it Rohs certified?	incompatible	conform to	conform to	incompatible
package instruction	27 X 27 MM, 1 MM PITCH, FCBGA-675	27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-675	BGA,	27 X 27 MM, 1 MM PITCH, FCBGA-675
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PBGA-B675	S-PBGA-B675	S-PBGA-B675	S-PBGA-B675
JESD-609 code	e0	e1	e1	e0
length	27 mm	27 mm	27 mm	27 mm
Humidity sensitivity level	4	4	4	4
Number of functions	1	1	1	1
Number of terminals	675	675	675	675
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.66 mm	2.66 mm	2.66 mm	2.66 mm
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm
Base Number Matches	1	1	1	1

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