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This circuit is a low noise amplifier, the input of which is connected to an ORP10 antimonide detector operating at room temperature. Four low noise transistors are connected in parallel as the fi...[Details]
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More and more applications, such as process control and weighing, require high-resolution, high-integration and low-cost ADCs. The new Σ-Δ conversion technology can meet these requirements. However...[Details]
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The simulation schematic diagram is as follows and the source program of the microcontroller is as follows: #include reg51.h sbit wr=P3^6; sbit rd=P3^2; sbit key0=P1^0; sbit key1=P1^1; sbit k...[Details]
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Continuous download 72
In order to further analyze the distributed capacitance of the multilayer coil, we rewrite equation (2-114) into the form of a static capacitance multiplied by a dynamic...[Details]
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The DC busbar of the main circuit adopts the following forms: 10~100A: PCB board
150~300A: busbar
400A~1000A: laminated busbar (below)
Absorption circuit design
...[Details]
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How to adjust the position ring of foc
The following steps are required to adjust the FOC position loop:
1. Determine the parameters related to the mechanical structure: Before adjusting ...[Details]
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Nokia (HMD Global) launched three new entry-level smartphones at MWC 2022. The three new models are Nokia C21, Nokia C21 Plus and Nokia C2 (second generation). They are all designed to "respo...[Details]
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The user program can be written according to the normal program, but the following points should be noted The program is written to a fixed location and cannot overlap with the location of the Boot...[Details]
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Choosing the Right Inductor and Capacitor for DC/DC Converters
As portable electronics continue to shrink in size, their complexity increases. This causes designers
to face more an...[Details]
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Although Sony's next-generation console PS5 has been launched, it has not brought an update to the VR kit. However, according to a new patent discovered by foreign media LetsGoDigital, Sony seems to ...[Details]
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Figure 1 shows the structure currently used in high-power LED packaging. The LED chip will first be packaged on a thermally conductive substrate, and then gold wire and sealing glue will be applied...[Details]
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Embedded vision components have been popular and adopted by numerous applications. What all of these applications have in common is the need to integrate more and more functionality int...[Details]
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The hottest industry at present is the Internet of Things, and the challenge facing the design of IoT products is how to maximize the power supply time of its ultra-small battery. These smart devices...[Details]
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Transformer Core Material Introduction
Almost all artificial magnetic materials are made of iron/nickel/cobalt as the main elements and then mixed with other non-magnetic materials a...[Details]
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Recently, the full-stack chassis domain controller
(CDC)
independently developed by Jingwei Hirain
was successfully installed in a certain
new energy vehicle
brand model and successfu...[Details]
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