MT16HTF51272AIZ-667XX datasheet, PDF

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MT16HTF51272AIZ-667XX: DescriptionDDR DRAM Module, 512MX64, CMOS, HALOGEN FREE, MO-237, UDIMM-240; Categorystorage storage; File Size365KB，18 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT16HTF51272AIZ-667XX Overview

DDR DRAM Module, 512MX64, CMOS, HALOGEN FREE, MO-237, UDIMM-240

MT16HTF51272AIZ-667XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
length	133.35 mm
memory density	34359738368 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	240
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Maximum seat height	4 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	DUAL
width	30 mm
Base Number Matches	1

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2GB, 4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM UDIMM

Features

DDR2 SDRAM UDIMM

MT18HTF25672AZ – 2GB

MT18HTF51272AZ – 4GB

Features

•

240-pin, unbuffered dual in-line memory module

•

Fast data transfer rates: PC2-8500, PC2-6400,

PC2-5300, PC2-4200, or PC2-3200

•

2GB (256 Meg x 72), 4GB (512 Meg x 72)

•

= V

DDQ

1.8V

•

DDSPD

= 1.7–3.6V

•

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

•

Differential data strobe (DQS, DQS#) option

•

4n-bit prefetch architecture

•

Supports ECC error detection and correction

•

Dual rank

•

Multiple internal device banks for concurrent

operation

•

Programmable CAS latency (CL)

•

Posted CAS additive latency (AL)

•

WRITE latency = READ latency - 1

•

Programmable burst lengths (BL): 4 or 8

•

Adjustable data-output drive strength

•

64ms, 8192-cycle refresh

•

On-die termination (ODT)

•

Serial presence detect (SPD) with EEPROM

•

Gold edge contacts

•

Halogen-free

Table 1: Key Timing Parameters

Speed

Grade

-1GA

-80E

-800

-667

-53E

-40E

Industry

Nomenclature

PC2-8500

PC2-6400

PC2-5300

PC2-4200

PC2-3200

Data Rate (MT/s)

CL = 7

1066

CL = 6

800

–

CL = 5

667

800

667

–

CL = 4

533

553

400

CL = 3

400

RCD

Figure 1: 240-Pin UDIMM (MO-237 R/C G)

Module height: 30mm (1.18in)

Options

•

Operating temperature

–

Commercial (0°C

≤

+70°C)

–

Industrial (–-40°C

≤

+85°C)

•

Package

–

240-pin DIMM (halogen-free)

•

Frequency/CL

–

1.875ns @ CL = 7 (DDR2-1066)

–

2.5ns @ CL = 5 (DDR2-800)

–

2.5ns @ CL = 6 (DDR2-800)

–

3ns @ CL = 5 (DDR2-667)

Notes:

Marking

None

-1GA

-80E

-800

-667

1. Contact Micron for industrial temperature

module offerings.

2. CL = CAS (READ) latency.

(ns)

13.125

12.5

(ns)

13.125

12.5

(ns)

58.125

57.5

PDF: 09005aef83c6d17f

htf18c256_512x72az.fm - Rev. B 2/10 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT16HTF51272AIZ-667XX Related Products

	MT16HTF51272AIZ-667XX	MT16HTF51272AZ-667XX
Description	DDR DRAM Module, 512MX64, CMOS, HALOGEN FREE, MO-237, UDIMM-240	DDR DRAM Module, 512MX64, CMOS, HALOGEN FREE, MO-237, UDIMM-240
Parts packaging code	DIMM	DIMM
package instruction	DIMM,	DIMM,
Contacts	240	240
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240
length	133.35 mm	133.35 mm
memory density	34359738368 bit	34359738368 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64
Number of functions	1	1
Number of ports	1	1
Number of terminals	240	240
word count	536870912 words	536870912 words
character code	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C
organize	512MX64	512MX64
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified
Maximum seat height	4 mm	4 mm
self refresh	YES	YES
Maximum supply voltage (Vsup)	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL
width	30 mm	30 mm
Base Number Matches	1	1

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