HB56RW872ES-8B datasheet, PDF - EEWORLD Datasheet

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HB56RW872ES-8B: DescriptionFast Page DRAM Module, 8MX72, 80ns, MOS, DIMM-168; Categorystorage storage; File Size303KB，26 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB56RW872ES-8B Overview

Fast Page DRAM Module, 8MX72, 80ns, MOS, DIMM-168

HB56RW872ES-8B Parametric

Parameter Name	Attribute value
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	80 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
Spare memory width	36
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	603979776 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	25.4 mm
Maximum standby current	0.046 A
Maximum slew rate	1.27 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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HB 56RW872ES Series

8,388,608-Word x 72-Bit(ECC) High Density Dynamic RAM

Module

Preliminary

Rev. 0

Dec. 19, 1995

The HB56RW872ES belongs to 8 Byte DIMM (Dual In-Line Memory Module) family, and has been

developed as an optimized main memory solution for 4 and 8 Byte processor applications.

The HB56RW872ES is a 8M x 72 dynamic RAM module, mounted 36 pieces of 16-Mbit DRAM

(HM51W16400) sealed in TCP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244)

sealed in TSSOP package.

An outline of the HB56RW872ES is 168-pin socket type package (dual-lead out).

Therefore, the HB56RW872ES makes high density mounting possible without surface mount technology.

The HB56RW872ES provides common data inputs and outputs.

Decoupling capacitors are mounted beside each TCP on its module board.

Features

•

168-pin socket type package (Dual lead out)



Lead pitch: 1.27 mm

•

Single 3.3 V (

0.3V) supply

•

High speed



Access time: tRAC = 60/70/80 ns (max.)



Access time: tCAC = 20/23/25 ns (max.)

•

Low power dissipation



Active mode: 5.54/4.90/4.57W (max.)



Standby mode: 295mW (max.)

•

Buffered input except/RAS and DQ

•

4 byte interleave enabled, dual address input (A0/B0)

•

Fast page mode capability

•

4,096 refresh cycle/64 ms

•

2 variations of refresh



/RAS - only refresh



/CAS - before - /RAS refresh

HB56RW872ES-8B Related Products

	HB56RW872ES-8B	HB56RW872ES-6B	HB56RW872ES-7B
Description	Fast Page DRAM Module, 8MX72, 80ns, MOS, DIMM-168	Fast Page DRAM Module, 8MX72, 60ns, MOS, DIMM-168	Fast Page DRAM Module, 8MX72, 70ns, MOS, DIMM-168
Parts packaging code	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168	168
Reach Compliance Code	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	80 ns	60 ns	70 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH
Spare memory width	36	36	36
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	603979776 bit	603979776 bit	603979776 bi
Memory IC Type	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
memory width	72	72	72
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	168	168	168
word count	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	8MX72	8MX72	8MX72
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096
Maximum seat height	25.4 mm	25.4 mm	25.4 mm
Maximum standby current	0.046 A	0.046 A	0.046 A
Maximum slew rate	1.27 mA	1.54 mA	1.36 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Base Number Matches	1	1	-

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