TC55WDM518AFFN16 datasheet, PDF

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TC55WDM518AFFN16: DescriptionIC 2M X 18 ZBT SRAM, 3.5 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM; Categorystorage storage; File Size477KB，20 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC55WDM518AFFN16 Overview

IC 2M X 18 ZBT SRAM, 3.5 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM

TC55WDM518AFFN16 Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	LQFP,
Contacts	100
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	3.5 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	37748736 bit
Memory IC Type	ZBT SRAM
memory width	18
Number of functions	1
Number of terminals	100
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
width	14 mm
Base Number Matches	1

TC55WDM518AFFN16 Related Products

	TC55WDM518AFFN16	TC55WDM518AFFN22	TC55WDM518AFFN15	TC55WDM518AFFN20
Description	IC 2M X 18 ZBT SRAM, 3.5 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM	IC 2M X 18 ZBT SRAM, 2.8 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM	IC 2M X 18 ZBT SRAM, 3.8 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM	IC 2M X 18 ZBT SRAM, 3.2 ns, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
Parts packaging code	QFP	QFP	QFP	QFP
package instruction	LQFP,	LQFP,	LQFP,	LQFP,
Contacts	100	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.5 ns	2.8 ns	3.8 ns	3.2 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0
length	20 mm	20 mm	20 mm	20 mm
memory density	37748736 bit	37748736 bit	37748736 bit	37748736 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	18	18	18	18
Number of functions	1	1	1	1
Number of terminals	100	100	100	100
word count	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	2MX18	2MX18	2MX18	2MX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.7 mm	1.7 mm	1.7 mm	1.7 mm
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
width	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	-

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