|
HD74HC00 |
HD74HC00FPEL |
HD74HC00RPEL |
HD74HC00P |
HD74HC00TELL |
Description |
HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
Number of functions |
4 |
4 |
4 |
4 |
4 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
85 Cel |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
series |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
Is it lead-free? |
- |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
- |
conform to |
conform to |
conform to |
conform to |
Maker |
- |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Parts packaging code |
- |
SOIC |
SOIC |
DIP |
TSSOP |
package instruction |
- |
SOP, SOP14,.3 |
3.95 X 8.65 MM, 1.27 MM PITCH, PLASTIC, SOP-14 |
6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14 |
4.4 X 5 MM, 0.65 MM PITCH, PLASTIC, TSSOP-14 |
Contacts |
- |
14 |
14 |
14 |
14 |
Reach Compliance Code |
- |
compli |
compliant |
unknow |
compliant |
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
JESD-30 code |
- |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDIP-T14 |
R-PDSO-G14 |
length |
- |
10.06 mm |
8.65 mm |
19.2 mm |
5 mm |
Load capacitance (CL) |
- |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
- |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
MaximumI(ol) |
- |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
Humidity sensitivity level |
- |
1 |
1 |
1 |
1 |
Number of entries |
- |
2 |
2 |
2 |
2 |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
SOP |
SOP |
DIP |
TSSOP |
Encapsulate equivalent code |
- |
SOP14,.3 |
SOP14,.25 |
DIP14,.3 |
TSSOP14,.25 |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
- |
TAPE AND REEL |
TAPE AND REEL |
- |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
NOT SPECIFIED |
260 |
power supply |
- |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
propagation delay (tpd) |
- |
115 ns |
115 ns |
115 ns |
115 ns |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
- |
NO |
NO |
NO |
NO |
Maximum seat height |
- |
2.2 mm |
1.75 mm |
5.06 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
- |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
- |
2 V |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
surface mount |
- |
YES |
YES |
NO |
YES |
technology |
- |
CMOS |
CMOS |
CMOS |
CMOS |
Terminal pitch |
- |
1.27 mm |
1.27 mm |
2.54 mm |
0.65 mm |
Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
- |
5.5 mm |
3.95 mm |
7.62 mm |
4.4 mm |
Base Number Matches |
- |
- |
1 |
1 |
1 |