R1WV3216R_08 datasheet, PDF - EEWORLD Datasheet

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R1WV3216R_08: Description32Mb Advanced LPSRAM (2M wordx16bit); File Size88KB，16 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R1WV3216R_08 Overview

32Mb Advanced LPSRAM (2M wordx16bit)

R1WV3216R_08 Related Products

	R1WV3216R_08	R1WV3216R	R1WV3216RBG-7SR	R1WV3216RBG-8SR	R1WV3216RBG-7SI	R1WV3216RSD-7SI	R1WV3216RSD-8SI	R1WV3216RSD-7SR	R1WV3216RSD-8SR	R1WV3216RBG-8SI
Description	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)	32Mb Advanced LPSRAM (2M wordx16bit)
Maker	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	-	-	BGA	BGA	BGA	TSOP2	TSOP2	TSOP2	TSOP2	BGA
package instruction	-	-	BGA, BGA48,6X8,30	BGA, BGA48,6X8,30	BGA, BGA48,6X8,30	TSSOP, TSSOP52,.4,16	TSSOP, TSSOP52,.4,16	TSSOP, TSSOP52,.4,16	TSSOP, TSSOP52,.4,16	BGA, BGA48,6X8,30
Contacts	-	-	48	48	48	52	52	52	52	48
Reach Compliance Code	-	-	compli	compli	compli	compli	unknow	unknow	compli	compli
ECCN code	-	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	-	-	70 ns	85 ns	70 ns	70 ns	85 ns	70 ns	85 ns	85 ns
I/O type	-	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	-	-	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G52	R-PDSO-G52	R-PDSO-G52	R-PDSO-G52	R-PBGA-B48
memory density	-	-	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi
Memory IC Type	-	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	-	-	16	16	16	16	16	16	16	16
Number of functions	-	-	1	1	1	1	1	1	1	1
Number of terminals	-	-	48	48	48	52	52	52	52	48
word count	-	-	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	-	-	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	-	-	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C	70 °C	85 °C
organize	-	-	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Output characteristics	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	BGA	BGA	BGA	TSSOP	TSSOP	TSSOP	TSSOP	BGA
Encapsulate equivalent code	-	-	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	TSSOP52,.4,16	TSSOP52,.4,16	TSSOP52,.4,16	TSSOP52,.4,16	BGA48,6X8,30
Package shape	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY
Parallel/Serial	-	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	-	-	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Minimum standby current	-	-	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	-	-	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	-	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	-	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal form	-	-	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING	GULL WING	BALL
Terminal pitch	-	-	0.75 mm	0.75 mm	0.75 mm	0.4 mm	0.4 mm	0.4 mm	0.4 mm	0.75 mm
Terminal location	-	-	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	DUAL	DUAL	BOTTOM

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