MX29LV161DBGBI-90G datasheet, PDF

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MX29LV161DBGBI-90G: DescriptionFlash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48; Categorystorage storage; File Size2MB，63 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX29LV161DBGBI-90G Overview

Flash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48

MX29LV161DBGBI-90G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	VFLGA, BGA48,6X11,20
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	90 ns
Other features	BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
length	6 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	1,2,1,31
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFLGA
Encapsulate equivalent code	BGA48,6X11,20
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	0.5 mm
Department size	8K,4K,16K,32K
Maximum standby current	0.000015 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	4 mm
Base Number Matches	1

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MX29LV161D T/B

DATASHEET

P/N:PM1359

REV. 1.0, JUN. 03, 2010

MX29LV161D T/B

Contents

FEATURES ............................................................................................................................................................ 5

GENERAL DESCRIPTION .................................................................................................................................... 6

PIN CONFIGURATIONS ........................................................................................................................................ 7

PIN DESCRIPTION ................................................................................................................................................ 9

BLOCK DIAGRAM............................................................................................................................................... 10

BLOCK DIAGRAM DESCRIPTION ..................................................................................................................... 11

BLOCK STRUCTURE.......................................................................................................................................... 12

Table 1-1. MX29LV161DT SECTOR ARCHITECTURE ............................................................................. 12

Table 1-2. MX29LV161DB SECTOR ARCHITECTURE ............................................................................ 13

BUS OPERATIONS ............................................................................................................................................. 14

Table 2-1. BUS OPERATION ..................................................................................................................... 14

Table 2-2. BUS OPERATION ..................................................................................................................... 15

FUNCTIONAL OPERATION DESCRIPTIONS .................................................................................................... 16

WRITE COMMANDS/COMMAND SEQUENCES ...................................................................................... 16

REQUIREMENTS FOR READING ARRAY DATA...................................................................................... 16

RESET# OPERATION ............................................................................................................................... 17

SECTOR PROTECT OPERATION ............................................................................................................ 17

CHIP UNPROTECT OPERATION............................................................................................................. 17

HARDWARE WRITE PROTECT ................................................................................................................ 17

ACCELERATED PROGRAMMING OPERATION ..................................................................................... 17

TEMPORARY SECTOR UNPROTECT OPERATION ............................................................................... 18

AUTOMATIC SELECT OPERATION.......................................................................................................... 18

VERIFY SECTOR PROTECT STATUS OPERATION ................................................................................ 18

DATA PROTECTION .................................................................................................................................. 18

LOW VCC WRITE INHIBIT ........................................................................................................................ 18

WRITE PULSE "GLITCH" PROTECTION.................................................................................................. 19

LOGICAL INHIBIT ...................................................................................................................................... 19

POWER-UP SEQUENCE .......................................................................................................................... 19

POWER-UP WRITE INHIBIT ..................................................................................................................... 19

POWER SUPPLY DECOUPLING .............................................................................................................. 19

COMMAND OPERATIONS .................................................................................................................................. 20

TABLE 3. MX29LV161D T/B COMMAND DEFINITIONS ........................................................................... 20

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ..................................................................... 21

ERASING THE MEMORY ARRAY ............................................................................................................. 21

SECTOR ERASE ....................................................................................................................................... 22

CHIP ERASE............................................................................................................................................. 23

SECTOR ERASE SUSPEND ..................................................................................................................... 23

SECTOR ERASE RESUME ....................................................................................................................... 24

AUTOMATIC SELECT OPERATIONS ....................................................................................................... 24

AUTOMATIC SELECT COMMAND SEQUENCE ...................................................................................... 24

P/N:PM1359

REV. 1.0, JUN. 03, 2010

MX29LV161D T/B

READ MANUFACTURER ID OR DEVICE ID ............................................................................................ 25

VERIFY SECTOR PROTECTION .............................................................................................................. 25

RESET ...................................................................................................................................................... 25

COMMON FLASH MEMORY INTERFACE (CFI) MODE .................................................................................... 26

QUERY COMMAND AND COMMON FLASH INTERFACE (CFI) MODE .................................................. 26

Table 4-1. CFI mode: Identification Data Values

........................................................................................ 26

Table 4-2. CFI Mode: System Interface Data Values

................................................................................. 26

Table 4-3. CFI Mode: Device Geometry Data Values

................................................................................. 27

Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values

........................................... 28

ELECTRICAL CHARACTERISTICS ................................................................................................................... 29

ABSOLUTE MAXIMUM STRESS RATINGS.............................................................................................. 29

OPERATING TEMPERATURE AND VOLTAGE ......................................................................................... 29

DC CHARACTERISTICS ........................................................................................................................... 30

SWITCHING TEST CIRCUIT ..................................................................................................................... 31

SWITCHING TEST WAVEFORM .............................................................................................................. 31

AC CHARACTERISTICS ........................................................................................................................... 32

WRITE COMMAND OPERATION........................................................................................................................ 33

Figure 1. COMMAND WRITE OPERATION

............................................................................................... 33

READ/RESET OPERATION ................................................................................................................................ 34

Figure 2. READ TIMING WAVEFORM

....................................................................................................... 34

Figure 3. RESET# TIMING WAVEFORM

.................................................................................................. 35

ERASE/PROGRAM OPERATION ....................................................................................................................... 36

Figure 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM

..................................................................... 36

Figure 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART

........................................................... 37

Figure 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM

............................................................... 38

Figure 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART

................................................... 39

Figure 8. ERASE SUSPEND/RESUME FLOWCHART

............................................................................. 40

Figure 9. AUTOMATIC PROGRAM TIMING WAVEFORM

......................................................................... 41

Figure 10. ACCELERATED PROGRAM TIMING DIAGRAM

.................................................................... 41

Figure 11. CE# CONTROLLED WRITE TIMING WAVEFORM

.................................................................. 42

Figure 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART

................................................... 43

SECTOR PROTECT/CHIP UNPROTECT ........................................................................................................... 44

Figure 13. SECTOR PROTECT/CHIP UNPROTECT WAVEFORM (RESET# Control)

........................... 44

Figure 14. IN-SYSTEM SECTOR PROTECT WITH RESET#=Vhv

........................................................... 45

Figure 15. CHIP UNPROTECT ALGORITHM WITH RESET#=Vhv

........................................................... 46

Table 5. TEMPORARY SECTOR UNPROTECT ........................................................................................ 47

Figure 16. TEMPORARY SECTOR UNPROTECT WAVEFORM

.............................................................. 47

Figure 17. TEMPORARY SECTOR UNPROTECT FLOWCHART

............................................................. 48

Figure 18. SILICON ID READ TIMING WAVEFORM

................................................................................. 49

WRITE OPERATION STATUS ............................................................................................................................. 50

Figure 19. DATA# POLLING TIMING WAVEFORM (DURING AUTOMATIC ALGORITHM)

...................... 50

Figure 20. DATA# POLLING ALGORITHM

................................................................................................ 51

P/N:PM1359

REV. 1.0, JUN. 03, 2010

MX29LV161DBGBI-90G Related Products

	MX29LV161DBGBI-90G	MX29LV161DTTI-90G	MX29LV161DTXBI-90G	MX29LV161DBTI-90G	MX29LV161DTXHI-90G	MX29LV161DBXHI-90G	MX29LV161DTGBI-90G	MX29LV161DBXBI-90G
Description	Flash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48	Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP-48	Flash, 1MX16, 90ns, PBGA48, 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48	Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP-48	Flash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, WFBGA-48	Flash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, WFBGA-48	Flash, 1MX16, 90ns, PBGA48, 4 X 6 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48	Flash, 1MX16, 90ns, PBGA48, 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	TSOP1	BGA	TSOP1	BGA	BGA	BGA	BGA
package instruction	VFLGA, BGA48,6X11,20	TSOP1, TSSOP48,.8,20	TFBGA, BGA48,6X8,32	TSOP1, TSSOP48,.8,20	VFBGA, BGA48,6X11,20	VFBGA, BGA48,6X11,20	VFLGA, BGA48,6X11,20	TFBGA, BGA48,6X8,32
Contacts	48	48	48	48	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	90 ns	90 ns	90 ns	90 ns	90 ns	90 ns	90 ns	90 ns
Other features	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK
startup block	BOTTOM	TOP	TOP	BOTTOM	TOP	BOTTOM	TOP	BOTTOM
command user interface	YES	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B48	R-PDSO-G48	R-PBGA-B48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
length	6 mm	18.4 mm	8 mm	18.4 mm	6 mm	6 mm	6 mm	8 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of departments/size	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31	1,2,1,31
Number of terminals	48	48	48	48	48	48	48	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFLGA	TSOP1	TFBGA	TSOP1	VFBGA	VFBGA	VFLGA	TFBGA
Encapsulate equivalent code	BGA48,6X11,20	TSSOP48,.8,20	BGA48,6X8,32	TSSOP48,.8,20	BGA48,6X11,20	BGA48,6X11,20	BGA48,6X11,20	BGA48,6X8,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	SMALL OUTLINE	GRID ARRAY	SMALL OUTLINE	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	0.5 mm	1.2 mm	1.2 mm	1.2 mm	0.75 mm	0.75 mm	0.5 mm	1.2 mm
Department size	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K	8K,4K,16K,32K
Maximum standby current	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL	GULL WING	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm
Terminal location	BOTTOM	DUAL	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
switch bit	YES	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	4 mm	12 mm	6 mm	12 mm	4 mm	4 mm	4 mm	6 mm
Base Number Matches	1	1	1	1	1	1	1	-

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