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WMS128K8L-45FIA

Description
Standard SRAM, 128KX8, 45ns, CMOS, CDFP36, DFP-36
Categorystorage    storage   
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WMS128K8L-45FIA Overview

Standard SRAM, 128KX8, 45ns, CMOS, CDFP36, DFP-36

WMS128K8L-45FIA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDFP
package instructionDFP,
Contacts36
Reach Compliance Codecompliant
Maximum access time45 ns
JESD-30 codeR-CDFP-F36
JESD-609 codee0
length23.37 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals36
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height2.897 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width12.95 mm
Base Number Matches1
WMS128K8-XXX
128Kx8 MONOLITHIC SRAM, SMD 5962-96691
FEATURES

Access Times 15, 17, 20, 25, 35, 45, 55ns

Revolutionary, Center Power/Ground Pinout JEDEC
Approved
• 32 lead Ceramic SOJ (Package 101)
• 36 lead Ceramic Flat Pack (Package 226)

Evolutionary, Corner Power/Ground Pinout JEDEC
Approved
• 32 pin Ceramic DIP (Package 300)
• 32 lead Ceramic SOJ (Package 101)
• 32 lead Ceramic Flat Pack (Package 206)
This product is subject to change without notice.

32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)

MIL-STD-883 Compliant Devices Available

Commercial, Industrial and Military Temperature Range

5 Volt Power Supply

Low Power CMOS

2V Data Retention Devices Available (Low Power Version)

TTL Compatible Inputs and Outputs
Revolutionary Pinout
32 DIP
Evolutionary Pinout
32 CSOJ (DE)
36 FLAT PACK
Top View
32 CSOJ (DR)
Top View
32 FLATPACK (FE)
Top View
32 CLCC
Top View
A12
A14
A16
A18
V
CC
A15
A17
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14 15 16 17 18 19 20
I/O1
I/02
V
SS
I/O3
I/O4
I/O5
I/O6
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
NC
A0
A1
A2
A3
CS#
I/O0
I/O1
V
CC
GND
I/O2
I/O3
WE#
A4
A5
A6
A7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
NC
A16
A15
A14
A13
OE#
I/O7
I/O6
GND
V
CC
I/O5
I/O4
A12
A11
A10
A9
A8
NC
A0
A1
A2
A3
CS#
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE#
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE#
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A12
A11
A10
A9
A8
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
NC
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
Pin Description
A
0-16
I/O
0-7
CS
OE
WE
V
CC
GND
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
Microsemi Corporation reserves the right to change products or specifications without notice.
March 2011
Rev. 6
© 2011 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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