SSW-103-03-S-T-RA datasheet, PDF

Datasheet> All Categories > The connector> The connector> SSW-103-03-S-T-RA

SSW-103-03-S-T-RA: DescriptionBoard Connector, 9 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Socket,; CategoryThe connector The connector; File Size527KB，3 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/

Download Datasheet Parametric View All

SSW-103-03-S-T-RA Overview

Board Connector, 9 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Socket,

SSW-103-03-S-T-RA Parametric

Parameter Name	Attribute value
Reach Compliance Code	compliant
ECCN code	EAR99
Body/casing type	SOCKET
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (30)
Contact completed and terminated	MATTE TIN
Contact point gender	FEMALE
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e3
MIL compliance	NO
Manufacturer's serial number	SSW-1
Mixed contacts	NO
Installation method	RIGHT ANGLE
Installation type	BOARD
Number of rows loaded	3
Options	GENERAL PURPOSE
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	9
UL Flammability Code	94V-0
Base Number Matches	1

Preview

Download Datasheet

View All

REVISION BX

SSW-1XX-XX-XXX-X-XX-XXX-XX

No OF POSITIONS

-01 THRU -50

(-P OPTION: 36 POS MAX)

DO NOT

SCALE FROM

THIS PRINT

LEAD STYLE

(SEE TABLE 1)

-01 THRU -06 (STD. INS. FORCE)

-21 THRU -24 (LOW INS. FORCE)

OPTION

-LL: LOCKING LEAD

(SEE FIG 4, SHT 2)

(N/A IN SINGLE ROW,

1 & 2 POSITION)

POLARIZING OPTION

INDICATE POS, SEE FIG 3, SHT 3

OPTION

-RA: RIGHT ANGLE (SEE FIG 2, SHT 2)

(STYLE -01 & -21 N/A)

-N: NOTCH (SEE FIG 6, SHT 3)

(ONLY AVAILABLE IN -D ROW)

(ONLY AVAILABLE IN 5, 7, 8, 10, 12,

13, 15, 17, 20, 25, 32, 36 POSITIONS)

(USE NSW-XX-D-N-XX BODY,

SEE TABLE 6)

PLATING SPECIFICATION

-G: 20µ" GOLD IN CONTACT AREA,

3µ" GOLD ON TAIL

-T: MATTE TIN CONTACT AND TAIL

(CONTACT -21 THRU -24 N/A)

-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,

MATTE TIN ON TAIL

-H: 30µ" HEAVY GOLD IN CONTACT AREA,

ROW SPECIFICATION

3µ" GOLD ON TAIL

-E: 50µ" EXTRA HEAVY GOLD IN CONTACT AREA,

-S: SINGLE

3µ" GOLD ON TAIL

-D: DOUBLE

(CONTACT -01 & -02 STRAIGHT ONLY)

-T: TRIPLE

-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA,

-P: SINGLE

MATTE TIN ON TAIL

-Q: TRIPLE WITH ONLY OUTER 2 ROWS

-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA,

FILLED

TIN/LEAD (90/10 ± 5%) TAIL

-TL: TIN/LEAD (90/10 ± 5%) CONTACT AND TAIL

(AVAILABLE ONLY ON LEAD STYLES -01)

-TM: MATTE TIN CONTACT AND TAIL (CONTACT -21 THRU -24 N/A)

-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,

MATTE TIN ON TAIL

-FM: 3µ" FLASH GOLD SELECTIVE IN CONTACT AREA,

MATTE TIN ON TAIL

-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA,

MATTE TIN ON TAIL

.050 1.27 REF

((No. OF POS x .10[2.5]) + .02[0.5])

SEE NOTE 10

.0110 0.280

REF

.095 2.41

REF

.095 2.41

REF

.245 6.22

.195 4.95

REF

SEE NOTE 8

.295 7.49

REF

60°

.335 8.51

DETAIL 'A'

SCALE 4 : 1

SEE NOTE 5

NOTES:

'A'

*"B"

.031 0.79 X .016[0.41]

REF (TYP)

+.000

*"B"

- .005

FOR

-S

MACHINE FILL ONLY

-P

.100 2.54

-D

FIG 1

-D-N

.100 2.54

.200 5.08

-T

REPRESENTS A CRITICAL DIMENSION.

2. MAXIMUM CUT FLASH: .015[.38] WITH NO FLASH BELOW STANDOFFS OR IN CONTACT HOLES.

3. MINIMUM CONTACT PUSHOUT FORCE: 1.5 LBS.

4. MAXIMUM ALLOWABLE BOW: .003[.08] INCH/INCH.

5. MAXIMUM ALLOWABLE SWAY: 2° (TYP) FOR HAND FILL & 1° (TYP) FOR MACHINE FILL.

6. MAXIMUM ALLOWABLE VARIATION BETWEEN ROWS: .010[.25].

7. "END WALLS" AFTER CUTTING SHOULD BE .020±.003 [.51±.08].

8. NOTCH ON -P-RA & -D-RA-N OPTIONS TO BE ORIENTED AS SHOWN.

9. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION.

10. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION

FOR MACHINE FILL.

11. LEAD STYLE X2 (SINGLE AND DOUBLE) -RA's TO BE LAYER PACKAGED. ALL OTHER -RA

LEAD STYLES: UNDER 5 POSITION TO BE LAYER PACKAGED, 5 AND UP TO BE PACKAGED

IN TUBES.

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

TOLERANCES ARE:

DECIMALS

PROPRIETARY NOTE

THIS DOCUMENT CONTAINS INFORMATION

CONFIDENTIAL AND PROPRIETARY TO

SAMTEC, INC. AND SHALL NOT BE REPRODUCED

OR TRANSFERRED TO OTHER DOCUMENTS OR

DISCLOSED TO OTHERS OR USED FOR ANY

PURPOSE OTHER THAN THAT WHICH IT WAS

OBTAINED WITHOUT THE EXPRESSED WRITTEN

CONSENT OF SAMTEC, INC.

.XX: .01 [.3]

.XXX: .005 [.13]

ANGLES

520 PARK EAST BLVD, NEW ALBANY, IN 47150

PHONE: 812-944-6733

FAX: 812-948-5047

e-Mail info@SAMTEC.com

code 55322

DESCRIPTION:

DWG. NO.

MATERIAL:

DO NOT SCALE DRAWING

INSULATOR:

-S, -D, -D-N: VECTRA E130i, COLOR: BLACK UL94 V0

-P, -T: PCT, COLOR: BLACK UL94 V0

CONTACT: PHOSPHOR BRONZE, SPRING TEMPER

ALLOY 511 OR 510

(TENSILE STRENGTH 90-100 KSI)

(YEILD STRENGTH @ 2% OFFSET 88-98 KSI)

PER MIL-B-13501

THICKNESS: .0160±.001 [0.635±0.03]

F:\DWG\MISC\MKTG\SSW-1XX-XX-XXX-X-XX-XXX-XX-MKT.SLDDRW

SHEET SCALE: 2:1

ASSEMBLY, SOCKET STRIP .016 X .031 TAIL

SSW-1XX-XX-XXX-X-XX-XXX-XX

06/12/1987

SHEET

BY:

PURVIS

Recommended Resources

Structure and working principle of 2-phase PWM circuit

Zener diode regulated power supply circuit

High-speed switch with clamping diode

GL3276A type circuit block diagram

Three-way output regulated power supply circuit diagram

Computer motherboard circuit diagram 440LX_09

280049Solution to the problem of LaunchPad emulator not being able to connect: This time I got a TI official LAUNCHXL-F280049C, the board comes with an XDS110 emulator, 280049 belongs to the Piccolo F28004x series To use F280049C, you need to install a higher version of CCS, bec...; 火辣西米秀 DSP and ARM Processors

Commonly used algorithms for drones - Kalman filter (XI): 4.3 Jacobian Matrix The Jacobian matrix is widely used in various occasions. The Jacobian is the differential ratio of the output to the input, indicating the influence of the change (differential) of...; sigma Electronics Design Contest

What is PWM "dead zone"?: PWM is pulse width modulation. In power electronics, the most commonly used are rectification and inversion. This requires the use of rectifier bridges and inverter bridges. For three-phase electricit...; qwqwqw2088 Analogue and Mixed Signal

E-sports data: Design and practice of common analog systems for e-sports based on TI devices - high-speed DAC module design: High-speed DAC module designThe high-speed DAC module includes two circuits: D/A output and signal conditioning. Most of the controlled objects are voltage-controlled, while most high-speed D/A chips ...; Jacktang Electronics Design Contest

How to choose 18650 charging IC?: The battery is a 18650 parallel battery pack as shown in the picture, with a voltage of 4.2V. The maximum charging current is required to be 2A. Is there any suitable charging IC recommended? Is this ...; dianhang Analog electronics

ATL431 by name parameters and package guidelines: ...; qwqwqw2088 Power technology

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components