M27C4001-55XB1 datasheet, PDF - EEWORLD Datasheet

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M27C4001-55XB1: Description512K X 8 OTPROM, 90 ns, PQCC32; Categorystorage storage; File Size178KB，24 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M27C4001-55XB1 Overview

512K X 8 OTPROM, 90 ns, PQCC32

M27C4001-55XB1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e3
length	42.035 mm
memory density	4194304 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.83 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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M27C4001

4 Mbit (512Kb x 8) UV EPROM and OTP EPROM

Feature summary

■

5V ± 10% supply voltage in Read operation

Access time: 35ns

Low power consumption:

– Active Current 30mA at 5MHz

– Standby Current 100µA

Programming voltage: 12.75V ± 0.25V

Programming time: 100µs/Word

Electronic signature

– Manufacturer Code: 20h

– Device Code: 41h

Packages

– ECOPACK® compliant versions

■

FDIP32W (F)

■

PDIP32 (B)

PLCC32 (C)

TSOP32 (N) 8 x 20 mm

March 2006

Rev 4

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www.st.com

M27C4001

List of tables

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Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18

PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19

PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20

TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21

Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

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