FIFO, 512X9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP28,.6 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 50 ns |
| Other features | RETRANSMIT |
| Maximum clock frequency (fCLK) | 33.3 MHz |
| period time | 65 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| length | 36.576 mm |
| memory density | 4608 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 4.699 mm |
| Maximum standby current | 0.015 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 20 |
| width | 15.24 mm |
| Base Number Matches | 1 |
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