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MT90222AG2

Description
ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384,
CategoryWireless rf/communication    Telecom circuit   
File Size873KB,155 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance  
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MT90222AG2 Overview

ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384,

MT90222AG2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Objectid113286129
Parts packaging codeBGA
Contacts384
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B384
Number of terminals384
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA384,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum slew rate425 mA
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
MT90222/3/4
4/8/16 Port IMA/TC PHY Device
Data Sheet
Features
IMA
Up to 16 T1, E1, J1, DSL links & up to 8 IMA
groups with 1 to 16 links/IMA group
1
Supports symmetrical & asymmetrical operation
CTC (common transmit) & ITC (independent
transmit) clocking modes
Pre-processing of RX ICP (IMA control protocol)
cells
IMA layer & per link statistics and alarms for
performance monitoring with MIB support
Ordering Information
MT90222AG
384 Pin PBGA Trays
MT90223AG
384 Pin PBGA Trays
MT90224AG
384 Pin PBGA Trays
MT90222AG2 384 Pin PBGA** Trays, Bake & Drypack
MT90223AG2 384 Pin PBGA** Trays
MT90224AG2 384 Pin PBGA** Trays
**Pb Free Tin/Silver/Copper
-40°C to +85°C
April 2006
HEC (header error control) verification &
generation, error detection, filler cell filtering (IMA
mode) and idle/unassigned cell filtering (TC
mode)
TC layer statistics and error counts i.e. HEC
errors with MIB support
TC and UNI
Supports mixed-mode operation: links not
assigned to an IMA group can be used in TC
mode
ATM framing using cell delineation
Standards Compliant
ATM Forum - IMA 1.1 (AF-PHY-0086.001) &
backwards compatible with IMA 1.0
ATM Forum - ATM over Fractional T1/E1 (AF-
PHY-0130.00)
ITU G.804 cell mapping & ITU I.432 cell
delineation
1. MT90222 supports up to 4 serial links with maximum 4 groups
to be used - groups 0,1,2,3.
MT90223 supports up to 8 serial links
MT90224 supports up to 16 serial links
RX External Static RAM
TDM Ring
RX
Utopia
Level 2
BUS
TX
Rx Utopia
FIFo
Internal IMA
Processors
(1 per group)
TDM
Ring
Control
S/P
T1/E1/DSL
Utopia
I/F CTRL
Cell
Delineator
CD Circuits (1 per link)
T1/E1/DSL
P/S
Tx Utopia
FIFo
Transmission
Convergence
TDM
Ring
Control
T1/E1/DSL
Serial TDM Ports
(1 per link, up to 10Mb/s
per link)
TC Circuits (1 per link)
Processor I/F
TDM Ring
Figure 1 - MT90222/3/4 Block Diagram (with Built-in IMA functions for up to 8 IMA Groups over
4/8/16 links)
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2006, Zarlink Semiconductor Inc. All Rights Reserved.

MT90222AG2 Related Products

MT90222AG2 MT90222AG MT90223AG2 MT90223AG MT90224AG MT90224AG2
Description ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384, ATM/SONET/SDH Segmentation and Reassembly Device, PBGA384, ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, LEAD FREE, PLASTIC, MS-034, BGA-384 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, PLASTIC, MS-034, BGA-384 ATM NETWORK INTERFACE, PBGA384, 27 X 27 MM, LEAD FREE, PLASTIC, MS-034, BGA-384
Is it lead-free? Lead free Contains lead Lead free Contains lead Contains lead Lead free
Parts packaging code BGA BGA BGA BGA BGA BGA
Contacts 384 384 384 384 384 384
Reach Compliance Code compliant unknown compliant compliant compliant compli
JESD-30 code S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384 S-PBGA-B384
Number of terminals 384 384 384 384 384 384
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40 BGA384,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES
Telecom integrated circuit types ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE ATM/SONET/SDH NETWORK INTERFACE
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Is it Rohs certified? - incompatible conform to incompatible incompatible conform to
Maker - Microsemi Microsemi Microsemi Microsemi Microsemi
power supply - 2.5,3.3,5 V 2.5,3.3,5 V 2.5,3.3,5 V 2.5,3.3,5 V 2.5,3.3,5 V
package instruction - - BGA, BGA384,26X26,40 BGA, BGA384,26X26,40 BGA, BGA384,26X26,40 BGA, BGA384,26X26,40
app - - ATM ATM ATM ATM
JESD-609 code - - e1 e0 e0 e1
length - - 27 mm 27 mm 27 mm 27 mm
Humidity sensitivity level - - 3 3 3 3
Number of functions - - 1 1 1 1
Peak Reflow Temperature (Celsius) - - NOT SPECIFIED 225 225 NOT SPECIFIED
Maximum seat height - - 2.28 mm 2.28 mm 2.28 mm 2.28 mm
Nominal supply voltage - - 2.5 V 2.5 V 2.5 V 2.5 V
Terminal surface - - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN SILVER COPPER
Maximum time at peak reflow temperature - - NOT SPECIFIED 30 30 NOT SPECIFIED
width - - 27 mm 27 mm 27 mm 27 mm

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