Power Management Circuit, PQCC28,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Summit |
package instruction | QCCN, LCC28,.2SQ,20 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Is Samacsys | N |
JESD-30 code | S-PQCC-N28 |
Humidity sensitivity level | 3 |
Number of terminals | 28 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.2SQ,20 |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 3/5 V |
Certification status | Not Qualified |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
SMM150N-XXXL | SMM150NC-XXXL | SMM150E-XXXV | SMM150EC-XXXV | SMM150E-XXX | SMM150EC-XXX | |
---|---|---|---|---|---|---|
Description | Power Management Circuit, PQCC28, | Power Management Circuit, PQCC28, | Power Management Circuit, PBGA20, | Power Management Circuit, PBGA20, | Power Management Circuit, PBGA20 | Power Management Circuit, PBGA20 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | incompatible | incompatible |
Maker | Summit | Summit | Summit | Summit | Summit | Summit |
package instruction | QCCN, LCC28,.2SQ,20 | QCCN, LCC28,.2SQ,20 | FBGA, BGA20,5X4,24 | FBGA, BGA20,5X4,24 | FBGA, BGA20,5X4,24 | FBGA, BGA20,5X4,24 |
Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknown |
Is Samacsys | N | N | N | N | N | N |
JESD-30 code | S-PQCC-N28 | S-PQCC-N28 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 |
Humidity sensitivity level | 3 | 3 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCN | QCCN | FBGA | FBGA | FBGA | FBGA |
Encapsulate equivalent code | LCC28,.2SQ,20 | LCC28,.2SQ,20 | BGA20,5X4,24 | BGA20,5X4,24 | BGA20,5X4,24 | BGA20,5X4,24 |
Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | YES | YES | YES |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | BALL | BALL | BALL | BALL |
Terminal pitch | 0.5 mm | 0.5 mm | 0.6 mm | 0.6 mm | 0.6 mm | 0.6 mm |
Terminal location | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | - | - |