Power Management Circuit, PBGA20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Summit |
| package instruction | FBGA, BGA20,5X4,24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 code | R-PBGA-B20 |
| Humidity sensitivity level | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA20,5X4,24 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.6 mm |
| Terminal location | BOTTOM |
| Base Number Matches | 1 |
| SMM150E-XXX | SMM150NC-XXXL | SMM150N-XXXL | SMM150E-XXXV | SMM150EC-XXXV | SMM150EC-XXX | |
|---|---|---|---|---|---|---|
| Description | Power Management Circuit, PBGA20 | Power Management Circuit, PQCC28, | Power Management Circuit, PQCC28, | Power Management Circuit, PBGA20, | Power Management Circuit, PBGA20, | Power Management Circuit, PBGA20 |
| Is it Rohs certified? | incompatible | conform to | conform to | conform to | conform to | incompatible |
| Maker | Summit | Summit | Summit | Summit | Summit | Summit |
| package instruction | FBGA, BGA20,5X4,24 | QCCN, LCC28,.2SQ,20 | QCCN, LCC28,.2SQ,20 | FBGA, BGA20,5X4,24 | FBGA, BGA20,5X4,24 | FBGA, BGA20,5X4,24 |
| Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | unknown |
| Is Samacsys | N | N | N | N | N | N |
| JESD-30 code | R-PBGA-B20 | S-PQCC-N28 | S-PQCC-N28 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 |
| Humidity sensitivity level | 1 | 3 | 3 | 1 | 1 | 1 |
| Number of terminals | 20 | 28 | 28 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | FBGA | QCCN | QCCN | FBGA | FBGA | FBGA |
| Encapsulate equivalent code | BGA20,5X4,24 | LCC28,.2SQ,20 | LCC28,.2SQ,20 | BGA20,5X4,24 | BGA20,5X4,24 | BGA20,5X4,24 |
| Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH | CHIP CARRIER | CHIP CARRIER | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES | YES | YES |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | BALL | NO LEAD | NO LEAD | BALL | BALL | BALL |
| Terminal pitch | 0.6 mm | 0.5 mm | 0.5 mm | 0.6 mm | 0.6 mm | 0.6 mm |
| Terminal location | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
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