(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0
ms,
1.0 kHz)
Operating Junction and Storage Temperature Range (Note 1)
Voltage Rate of Change (Rated V
R
)
Total Device
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FRM
I
FSM
I
RRM
T
J
, T
stg
dv/dt
Value
100
Unit
V
10
20
20
150
0.5
−
65 to +175
10000
A
A
A
A
°C
V/ms
RMS Isolation Voltage (t = 0.3 second, R.H.
≤
30%, T
A
= 25°C) (Note 2)
V
iso1
4500
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
(Per Leg)
Rating
Maximum Thermal Resistance, Junction to Case
Lead Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds
Symbol
R
qJC
T
L
Symbol
v
F
Value
3.5
260
Unit
°C/W
°C
Unit
V
0.85
0.75
0.95
0.85
mA
0.15
150
ELECTRICAL CHARACTERISTICS
(Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 10 Amp, T
C
= 25°C)
(i
F
= 10 Amp, T
C
= 125°C)
(i
F
= 20 Amp, T
C
= 25°C)
(i
F
= 20 Amp, T
C
= 125°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, T
C
= 25°C)
(Rated DC Voltage, T
C
= 125°C)
Max
i
R
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP
D
/dT
J
< 1/R
qJA
.
2. Proper strike and creepage distance must be provided.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
50
I R, REVERSE CURRENT (mA)
20
10
100°C
5.0
3.0
T
J
= 25°C
150°C
10
T
J
= 125°C
T
J
= 100°C
1.0
T
J
= 150°C
0.1
1.0
0.5
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
v
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
1.0
0.01
0
20
T
J
= 25°C
40
60
80
100
V
R
, REVERSE VOLTAGE (VOLTS)
120
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
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2
MBRF20100CT
MARKING DIAGRAMS
AYWW
B20100G
AKA
TO−220
B20100
A
Y
WW
G
AKA
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
= Polarity Designator
ORDERING INFORMATION
Device
MBRF20100CTG
Package
TO−220
(Pb−Free)
Shipping
†
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
3
MBRF20100CT
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE K
−T−
F
Q
A
1 2 3
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
INCHES
MIN
MAX
0.617
0.635
0.392
0.419
0.177
0.193
0.024
0.039
0.116
0.129
0.100 BSC
0.118
0.135
0.018
0.025
0.503
0.541
0.048
0.058
0.200 BSC
0.122
0.138
0.099
0.117
0.092
0.113
0.239
0.271
MILLIMETERS
MIN
MAX
15.67
16.12
9.96
10.63
4.50
4.90
0.60
1.00
2.95
3.28
2.54 BSC
3.00
3.43
0.45
0.63
12.78
13.73
1.23
1.47
5.08 BSC
3.10
3.50
2.51
2.96
2.34
2.87
6.06
6.88
−B−
U
C
S
H
K
−Y−
G
N
L
D
3 PL
M
J
R
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
U
0.25 (0.010)
B
M
Y
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
FULLPAK is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
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Order Literature:
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For additional information, please contact your local
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