• Temperature Range:-55ºC ~ +155ºC (derated over 70ºC)
• Value Range: 10~1M
• Wave or Flow Solderable
DERATING CURVE
Percent Rated Load (%)
-55ºC
100
80
60
40
20
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
Ambient Temperature (ºC)
+70ºC
+155ºC
HP1-RC Series
PART NUMBERING SYSTEM
3
1
Series
3
-
1
0
Value
K
-
R
E
E
L
-
R
C
Package
Suffix
(RoHS Compliant)
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
C
W
H
D
Series
313
315
317
319
D
Case Size
0603
0805
1206
2512
Watts (W)
1/5
1/3
1/2
2
Voltage (V) (max.)
W.V.
O.V.
50
100
150
300
200
400
250
500
L
1.60±.10
2.00±.15
3.10±.15
6.35±.10
W
.80±.15
1.25±.15
1.55±.15
3.20±.15
Dimension (mm)
H
.45±.10
.55±.10
.55±.10
.55±.10
C
.30±.20
.40±.20
.45±.20
.60±.25
D
.30±.20
.40±.20
.45±.20
.50±.20
L
C
L
W
H
STANDARD VALUES (Ω)
10
10.2
10.7
11
12
13
15
16
18
20
22
24
27
30
30.1
33
36
39
43
47
49.9
51
56
62
68
68.1
71.5
75
82
91
100
110
120
130
150
160
180
182
200
220
221
240
270
300
301
330
340
360
390
430
470
499
510
549
560
620
680
750
820
1.0K
1.1K
1.2K
1.5K
1.5K
1.6K
1.8K
2.0K
2.2K
2.21K
2.4K
2.7K
3.0K
3.3K
3.32K
3.6K
3.83K
3.9K
4.3K
4.7K
4.99K
5.1K
5.23K
5.6K
6.2K
6.8K
7.32K
7.5K
8.2K
8.66K
9.1K
10K
11K
12K
13K
15K
16K
18K
20K
22K
24K
27K
30K
33K
34.8K
36K
39K
40.2K
43K
47K
51K
56K
56.2K
62K
68K
75K
76.8K
82K
100K
120K
130K
150K
180K
200K
220K
267K
270K
330K
390K
432K
470K
510K
523K
560K
680K
750K
820K
1.0M
XC-600246
XICON PASSIVE COMPONENTS • (800) 628-0544
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 5/31/17
1% High Power Thick Film Resistors
(RoHS
Compliant)
CHARACTERISTICS
HP1-RC Series
Characteristics
Dielectric
withstanding
voltage
Limits
No evidence of flashover
mechanical damage, arcing or insulation
break down
Test Methods
(JIS C 5201-1)
4.7 Clamped in the trough of a 90ºC metallic v-block and shall be tested
at ac potential respectively specified in the type for 60-70 seconds
4.8 Natural resistance change per temp.
degree centigrade.
Temperature
Coefficient
1Ω~10Ω≤±200PPM/ºC
10.1Ω~10MΩ≤±100PPM/ºC
R2-R1
x 10
6
(PPM/ºC)
R1(t2-t1)
R1: Resistance value at room temperature (T1)
R2: Resistance value at room tem. plus 100ºC(T2)
Test pattern: room temp. (T1), room temp. +100ºC(T2)
4.13 Permanent resistance change after the application of a potential of
2.5 times RCWV for 5 seconds
Short time
overload
Resistance change rate is
± 5% (2.0% + 0.1Ω) Max.
± 1% (1.0% + 0.1Ω) Max.
Wave Solder:
Test temperature of solder:
245ºC±3ºC dipping time in solder: 2-3 seconds.
Reflow:
250
VALUE TEMPERATURE:
245ºC -250ºC
230ºC
WARM-UP TIME
Solderability
95% coverage Min.
200
150
100
50
180ºC
150ºC
90±30s
20±10s
HOT UP TIME
SOLDER TIME
Soldering heat
Resistance change rate is
+ (1.0% + 0.05Ω) Max.
4.18 Dip the resistor into a solder bath having a temperature of
260ºC±3ºC and hold it for 10±1 seconds
4.19 Resistance change after continiuous
5 cycles for duty cycle specified below:
Step
1
2
3
4
Temperature
-55ºC ±3ºC
Room temp.
+155ºC ±2C
Room temp.
Time
30 mins
10~15 mins
30 mins
10`15 mins
Temperature
Cycling
Resistance change rate is
± 5% (2.0% + 0.05Ω) Max.
± 1% (0.5% + 0.05Ω) Max.
XC-600246
XICON PASSIVE COMPONENTS • (800) 628-0544
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 5/31/17
1% High Power Thick Film Resistors
(RoHS
Compliant)
CHARACTERISTICS (CON'T)
HP1-RC Series
Characteristics
Limits
Test Methods
(JIS C 5201-1)
4.24 Temporary resistance change after 240 hours exposure in a humid-
ity test chamber controlled at 40±2ºC and 90-95% humidity
Humidity
Resistance change rate is
± 5% (3.0% + 0.1Ω) Max.
± 1% (0.5% + 0.1Ω) Max.
Load life in humidity
Resistance change rate is
± 5% (3.0% + 0.1Ω) Max.
± 1% (0.5% + 0.1Ω) Max.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40ºC ± 2ºC and 90 to 95% relative humidity
Load Life
Resistance change rate is
± 5% (3.0% + 0.1Ω) Max.
± 1% (0.5% + 0.1Ω) Max.
4.25.1 Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
(1.5 hours"on", 0.5 hour"0ff") at 70ºC ± 2ºC ambient
4.33 Twist of Test Board:
Y/X - 3/90 mm for 60 seconds
Terminal bending
Resistance change rate is
± (1.0% + 0.05Ω) Max.
XC-600246
XICON PASSIVE COMPONENTS • (800) 628-0544
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
[Xianji HPM6750 Review] HPM SDK Development Environment Construction and Hello World
In the previous post, we introduced how to download the materials needed for HPM6750 development, including the dev...
[i=s]This post was last edited by Jacktang on 2019-10-10 21:35[/i]The state machine switching diagram of the terminal device during operation is as follows. This diagram comes from Figure 5 in the doc...
Some time ago, I bought a toy from Hasbro. Yes, it is the protagonist of today, Bumblebee. The manufacturer is really honest! It is indeed a toy... It is a toy no matter how you look at it... Oh... Th...
Protective version of "Jueying" intelligent robot dogOn May 31, Hangzhou Yunshenchu Technology publicly released the protective version of the "Jueying" robot dog, which can demonstrate excellent prot...
Practical sine wave generating circuit diagramAuthor: Unknown Article Source: UnknownPractical sine wave generating circuit diagram: Below is a sine wave circuit made with a TL082 op amp! Follow the c...
[size=6]Foreword[/size] [size=4]I was originally very interested in this small module, but it happened that I was on a business trip for more than half a month some time ago.... I took[/size][size=4] ...
According to Jiwei.com, on March 31, SMIC announced its 2020 annual financial report, with full-year revenue reaching US$3.907 billion, a record high, up 25.4% from US$3.116 billion in 2019. SMIC's...[Details]
Nidec Advanced Testing Technology Co., Ltd. (hereinafter referred to as "the Company") has established a subsidiary, Nidec Advanced Testing Technology (India) Private Limited, in Bangalore, Karnata...[Details]
TMS320VC5409 is the first generation of high-performance, low-cost, low-power digital signal processor (DSP) launched by TI. Compared with the popular TMS320C5409, the performance is improved by 60...[Details]
"Splicing" chips seems to have become the new "fashion" in the chip circle. At Apple’s spring new product launch conference in March, it released the M1 Ultra, which is made by “gluing” two M1 Max...[Details]
Following the software revolution, the open source movement is changing the chip industry. Source: Bloomberg Large technology companies have begun to get involved in RISC-V, which replaces propriet...[Details]
Safety and functionality are two main goals in the evolution of automotive technology. The former is people's core demand for cars as a means of transportation, in order to prevent accidents caused b...[Details]
This Beagle tracker provides accurate, GPS-free location tracking and simplifies deployment for those without much Internet of Things (IoT) experience Semtech Corporation, a leading supplier of hig...[Details]
Memory is divided into two major categories: RAM and ROM. This article mainly discusses ROM. . The ROM cannot be programmed initially, and whatever content is shipped from the factory will always be ...[Details]
1 Introduction
In the 21st century, mankind will face major challenges in achieving sustainable economic and social development. Under the dual constraints of limited resources and e...[Details]
Customers Speak: Checkmarx Named 2022 Gartner® Peer Insights™ Customer Application Security Testing Choice for the Fourth Consecutive Year Checkmarx is the only vendor rated Customer Choice in all ...[Details]
The battlefield electromagnetic environment has a profound impact on war preparations and various military activities, especially on battlefield perception, command and control, combat operations,...[Details]
There is a great demand for short-range radio remote control, but the design and debugging of radio frequency circuits are relatively complex, and the requirements for personnel and equipment are h...[Details]
In recent years, electric vehicle technology, especially its battery technology, has developed rapidly. This article will explore the 11 most common misconceptions about electric vehicle (EV) bat...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
