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S71WS512ND0BFWA30

Description
Stacked Multi-Chip Product (MCP)
File Size2MB,188 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet View All

S71WS512ND0BFWA30 Overview

Stacked Multi-Chip Product (MCP)

S71WS-Nx0 Based MCPs
Stacked Multi-Chip Product (MCP)
128/256/512 Megabit (32M/16M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with
pSRAM Type 4
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_01
Revision
A
Amendment
4
Issue Date
September 15, 2005
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
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