SN74ACT2235-60FN datasheet, PDF

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SN74ACT2235-60FN: DescriptionFIFO 1024x9x2 ASynch Bi directional FIFO Mem; Categorystorage storage; File Size288KB，17 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74ACT2235-60FN Overview

FIFO 1024x9x2 ASynch Bi directional FIFO Mem

SN74ACT2235-60FN Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	LCC
package instruction	QCCJ, LDCC44,.7SQ
Contacts	44
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Description	SN74ACT2235-60FN, FIFO Memory Dual 18kbit 1K x 9 bit Bi-Directional 25ns 16.7MHz 4.5 → 5.5 V 44-Pin PLCC
Maximum access time	45 ns
Other features	BYPASS-XCVR
Maximum clock frequency (fCLK)	16.7 MHz
period time	60 ns
JESD-30 code	S-PQCC-J44
JESD-609 code	e4
length	16.585 mm
memory density	9216 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	44
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	16.585 mm
Base Number Matches	1

SN74ACT2235-60FN Related Products

	SN74ACT2235-60FN	SN74ACT2235-20PAG	SN74ACT2235-60PAG	SN74ACT2235-40PAG	SN74ACT2235-40FN	SN74ACT2235-30PAG
Description	FIFO 1024x9x2 ASynch Bi directional FIFO Mem	FIFO 1024x9x2 Asynch Bidir FIFO Mem	FIFO 1024x9x2 Asynch Bidir FIFO Mem	FIFO 1024x9x2 Asynch Bidir FIFO Mem	FIFO 1024x9x2 ASynch Bi directional FIFO Mem	FIFO 1024x9x2 Asynch Bidir FIFO Mem
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Contains lead	Contains lead	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	LCC	QFP	QFP	QFP	LCC	QFP
package instruction	QCCJ, LDCC44,.7SQ	TFQFP, TQFP64,.47SQ	TFQFP, TQFP64,.47SQ	TFQFP, TQFP64,.47SQ	QCCJ, LDCC44,.7SQ	TFQFP, TQFP64,.47SQ
Contacts	44	64	64	64	44	64
Reach Compliance Code	compliant	compli	compliant	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	1 week	1 week	1 week	1 week	1 week	1 week
Maximum access time	45 ns	25 ns	45 ns	35 ns	35 ns	25 ns
Other features	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR
Maximum clock frequency (fCLK)	16.7 MHz	50 MHz	16.7 MHz	25 MHz	25 MHz	33 MHz
period time	60 ns	20 ns	60 ns	40 ns	40 ns	30 ns
JESD-30 code	S-PQCC-J44	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQCC-J44	S-PQFP-G64
JESD-609 code	e4	e4	e4	e4	e4	e4
length	16.585 mm	10 mm	10 mm	10 mm	16.585 mm	10 mm
memory density	9216 bit	9216 bi	9216 bit	9216 bi	9216 bi	9216 bi
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
memory width	9	9	9	9	9	9
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of terminals	44	64	64	64	44	64
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1KX9	1KX9	1KX9	1KX9	1KX9	1KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	TFQFP	TFQFP	TFQFP	QCCJ	TFQFP
Encapsulate equivalent code	LDCC44,.7SQ	TQFP64,.47SQ	TQFP64,.47SQ	TQFP64,.47SQ	LDCC44,.7SQ	TQFP64,.47SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	CHIP CARRIER	FLATPACK, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	1.2 mm	1.2 mm	1.2 mm	4.57 mm	1.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	J BEND	GULL WING	GULL WING	GULL WING	J BEND	GULL WING
Terminal pitch	1.27 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	16.585 mm	10 mm	10 mm	10 mm	16.585 mm	10 mm

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