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SN74ACT2235-60PAG

Description
FIFO 1024x9x2 Asynch Bidir FIFO Mem
Categorystorage    storage   
File Size288KB,17 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74ACT2235-60PAG Overview

FIFO 1024x9x2 Asynch Bidir FIFO Mem

SN74ACT2235-60PAG Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeQFP
package instructionTFQFP, TQFP64,.47SQ
Contacts64
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time1 week
Maximum access time45 ns
Other featuresBYPASS-XCVR
Maximum clock frequency (fCLK)16.7 MHz
period time60 ns
JESD-30 codeS-PQFP-G64
JESD-609 codee4
length10 mm
memory density9216 bit
Memory IC TypeBI-DIRECTIONAL FIFO
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals64
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX9
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeTFQFP
Encapsulate equivalent codeTQFP64,.47SQ
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm
Base Number Matches1

SN74ACT2235-60PAG Related Products

SN74ACT2235-60PAG SN74ACT2235-20PAG SN74ACT2235-60FN SN74ACT2235-40PAG SN74ACT2235-40FN SN74ACT2235-30PAG
Description FIFO 1024x9x2 Asynch Bidir FIFO Mem FIFO 1024x9x2 Asynch Bidir FIFO Mem FIFO 1024x9x2 ASynch Bi directional FIFO Mem FIFO 1024x9x2 Asynch Bidir FIFO Mem FIFO 1024x9x2 ASynch Bi directional FIFO Mem FIFO 1024x9x2 Asynch Bidir FIFO Mem
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Contains lead Contains lead Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QFP QFP LCC QFP LCC QFP
package instruction TFQFP, TQFP64,.47SQ TFQFP, TQFP64,.47SQ QCCJ, LDCC44,.7SQ TFQFP, TQFP64,.47SQ QCCJ, LDCC44,.7SQ TFQFP, TQFP64,.47SQ
Contacts 64 64 44 64 44 64
Reach Compliance Code compliant compli compliant compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time 1 week 1 week 1 week 1 week 1 week 1 week
Maximum access time 45 ns 25 ns 45 ns 35 ns 35 ns 25 ns
Other features BYPASS-XCVR BYPASS-XCVR BYPASS-XCVR BYPASS-XCVR BYPASS-XCVR BYPASS-XCVR
Maximum clock frequency (fCLK) 16.7 MHz 50 MHz 16.7 MHz 25 MHz 25 MHz 33 MHz
period time 60 ns 20 ns 60 ns 40 ns 40 ns 30 ns
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-PQCC-J44 S-PQFP-G64 S-PQCC-J44 S-PQFP-G64
JESD-609 code e4 e4 e4 e4 e4 e4
length 10 mm 10 mm 16.585 mm 10 mm 16.585 mm 10 mm
memory density 9216 bit 9216 bi 9216 bit 9216 bi 9216 bi 9216 bi
Memory IC Type BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO
memory width 9 9 9 9 9 9
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 64 64 44 64 44 64
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1KX9 1KX9 1KX9 1KX9 1KX9 1KX9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFQFP TFQFP QCCJ TFQFP QCCJ TFQFP
Encapsulate equivalent code TQFP64,.47SQ TQFP64,.47SQ LDCC44,.7SQ TQFP64,.47SQ LDCC44,.7SQ TQFP64,.47SQ
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, THIN PROFILE, FINE PITCH FLATPACK, THIN PROFILE, FINE PITCH CHIP CARRIER FLATPACK, THIN PROFILE, FINE PITCH CHIP CARRIER FLATPACK, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 4.57 mm 1.2 mm 4.57 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING J BEND GULL WING J BEND GULL WING
Terminal pitch 0.5 mm 0.5 mm 1.27 mm 0.5 mm 1.27 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 10 mm 10 mm 16.585 mm 10 mm 16.585 mm 10 mm

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