FIFO 1024x9x2 Asynch Bidir FIFO Mem
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | QFP |
| package instruction | TFQFP, TQFP64,.47SQ |
| Contacts | 64 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Maximum access time | 25 ns |
| Other features | BYPASS-XCVR |
| Maximum clock frequency (fCLK) | 50 MHz |
| period time | 20 ns |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e4 |
| length | 10 mm |
| memory density | 9216 bi |
| Memory IC Type | BI-DIRECTIONAL FIFO |
| memory width | 9 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 64 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFQFP |
| Encapsulate equivalent code | TQFP64,.47SQ |
| Package shape | SQUARE |
| Package form | FLATPACK, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10 mm |
| SN74ACT2235-20PAG | SN74ACT2235-60PAG | SN74ACT2235-60FN | SN74ACT2235-40PAG | SN74ACT2235-40FN | SN74ACT2235-30PAG | |
|---|---|---|---|---|---|---|
| Description | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 ASynch Bi directional FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem | FIFO 1024x9x2 ASynch Bi directional FIFO Mem | FIFO 1024x9x2 Asynch Bidir FIFO Mem |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Is it lead-free? | Contains lead | Contains lead | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | QFP | QFP | LCC | QFP | LCC | QFP |
| package instruction | TFQFP, TQFP64,.47SQ | TFQFP, TQFP64,.47SQ | QCCJ, LDCC44,.7SQ | TFQFP, TQFP64,.47SQ | QCCJ, LDCC44,.7SQ | TFQFP, TQFP64,.47SQ |
| Contacts | 64 | 64 | 44 | 64 | 44 | 64 |
| Reach Compliance Code | compli | compliant | compliant | compli | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week |
| Maximum access time | 25 ns | 45 ns | 45 ns | 35 ns | 35 ns | 25 ns |
| Other features | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR | BYPASS-XCVR |
| Maximum clock frequency (fCLK) | 50 MHz | 16.7 MHz | 16.7 MHz | 25 MHz | 25 MHz | 33 MHz |
| period time | 20 ns | 60 ns | 60 ns | 40 ns | 40 ns | 30 ns |
| JESD-30 code | S-PQFP-G64 | S-PQFP-G64 | S-PQCC-J44 | S-PQFP-G64 | S-PQCC-J44 | S-PQFP-G64 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 10 mm | 10 mm | 16.585 mm | 10 mm | 16.585 mm | 10 mm |
| memory density | 9216 bi | 9216 bit | 9216 bit | 9216 bi | 9216 bi | 9216 bi |
| Memory IC Type | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 64 | 64 | 44 | 64 | 44 | 64 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TFQFP | TFQFP | QCCJ | TFQFP | QCCJ | TFQFP |
| Encapsulate equivalent code | TQFP64,.47SQ | TQFP64,.47SQ | LDCC44,.7SQ | TQFP64,.47SQ | LDCC44,.7SQ | TQFP64,.47SQ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 4.57 mm | 1.2 mm | 4.57 mm | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING | GULL WING | J BEND | GULL WING | J BEND | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10 mm | 10 mm | 16.585 mm | 10 mm | 16.585 mm | 10 mm |
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