A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[backcolor=white][size=4][color=#000000]I am a DSP newbie. I only know that the stack is used to protect the scene when interrupting or calling a subroutine. But what is the purpose of this program se...
When there is no board, using a simulator (soft simulation) to verify the algorithm is an effective way. TI's CCS provides three soft simulation methods: CPU Cycle Accurate, Device Functional and Devi...
In today's industrial space, there are multiple solutions and architectures for various motor drive, factory automation, and high-power grid applications. Many of them have reliable performance and co...
Class D amplifiers have better efficiency and thermal performance than Class AB amplifiers, but implementing a Class D amplifier still requires good electrical and thermal design practices. Most engin...
As standards continue to evolve, test solutions must support higher frequencies, wider bandwidths and new physical layer capabilities. Thanks to the faster, more reliable, and near-instantaneous conn...[Details]
Common Mode Semiconductor has launched the GM1203B series of high-precision, low-noise 3A LDO regulators. The GM1203B series combines low noise, high PSRR, and high output current capabilities, m...[Details]
According to the Yangtze Evening News, China Electronics Pengcheng has developed a third-generation semiconductor wafer dicing machine. The flatness of the product is less than 5 microns after the wa...[Details]
#include reg52.h sbit dula=P2^6; //Declare the latch end of U1 register, P2^6 is the segment lock sbit wela=P2^7; // declare U2, P2^7 is Laohuang? main() { wela=1; //Open U2 latch terminal P0=0xfe...[Details]
New superior timing products for high-performance communications and data center applications
Beijing, China, April 18, 2024 -
Renesas Electronics, a global supplier of semicondu...[Details]
The Greater Bay Area Science and Technology Innovation Forum will officially kick off the 2022 StartmeupHK Hong Kong Entrepreneurship Festival on September 5 Gathering the innovative forces in the...[Details]
On April 3, the Huzhou Synear Food Peak Shaving and Valley Filling Energy Storage Project invested and constructed by Huzhou Qingtai New Energy Technology Co., Ltd., a subsidiary of the Group, started...[Details]
Investment bank Wedbush predicts that the iPhone 12 will be launched around the same time as the iPhone X, and despite the challenges of the coronavirus, 5G will bring a super cycle for Apple in 2020...[Details]
Serial peripheral interface SPI (serial peripheral interface) bus technology is a synchronous serial interface introduced by Motorola. It allows the CPU to communicate with peripheral interface dev...[Details]
Dual power supply refers to: a device controlled by a microprocessor, used for switching between grid power and grid power or grid power and generator power in a power grid system, which can prov...[Details]
Nvidia CEO Jensen Huang has stated in public many times in recent years that "Moore's Law is dead." Although Intel and AMD executives hold different views, a report recently released by Google once a...[Details]
In fact, you may not know that in the past eight years, the new energy vehicle market has experienced a transformation from focusing on pure electric vehicles to focusing on hybrid vehicles. This may...[Details]
On April 1, Fenghua Hi-Tech announced that the company's board of directors received a written resignation report from Mr. Wang Guangjun, the company's chairman, on March 31, 2020. Mr. Wang Guangjun ...[Details]
Wang Liqiao, Li Zhanyi, Liu Le, and Huang Haiwen, researchers from the Hebei Key Laboratory of Power Electronics Energy Saving and Drive Control of Yanshan University and the Qinhuangdao Funing Distri...[Details]
Intelligent driving domain control is a key component of smart cars. It integrates high-performance computing units, complex sensor data processing algorithms and advanced control logic to realize ...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
