IC EEPROM 8K I2C 1MHZ 8TSSOP
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| package instruction | TSSOP-8 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 12 weeks |
| Maximum clock frequency (fCLK) | 1 MHz |
| Data retention time - minimum | 100 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DMMR |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 4.4 mm |
| memory density | 8192 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000001 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE |
| AT24C08C-XHM-T | AT24C04C-WWU11M | AT24C04C-XHM-B | AT24C08C-PUM | AT24C08C-CUM-T | |
|---|---|---|---|---|---|
| Description | IC EEPROM 8K I2C 1MHZ 8TSSOP | AT24C04C-WWU11M | EEPROM 4K (512x8) 2-WIRE NiPdAu, 1.7V | IC EEPROM 8K I2C 1MHZ 8DIP | IC EEPROM 8K I2C 1MHZ 8VFBGA |
| package instruction | TSSOP-8 | DIE, | TSSOP-8 | DIP, DIP8,.3 | VFBGA-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 code | R-PDSO-G8 | X-XUUC-N | R-PDSO-G8 | R-PDIP-T8 | R-PBGA-B8 |
| memory density | 8192 bit | 4096 bit | 4096 bit | 8192 bit | 8192 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| word count | 1024 words | 512 words | 512 words | 1024 words | 1024 words |
| character code | 1000 | 512 | 512 | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 1KX8 | 512X8 | 512X8 | 1KX8 | 1KX8 |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | DIE | TSSOP | DIP | VFBGA |
| Package shape | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Serial bus type | I2C | I2C | I2C | I2C | I2C |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| Nominal supply voltage (Vsup) | 5 V | 3 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | NO LEAD | GULL WING | THROUGH-HOLE | BALL |
| Terminal location | DUAL | UPPER | DUAL | DUAL | BOTTOM |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Is it lead-free? | Lead free | - | Lead free | Lead free | - |
| Is it Rohs certified? | conform to | - | conform to | conform to | conform to |
| Maker | Microchip | Microchip | Microchip | - | Microchip |
| Factory Lead Time | 12 weeks | - | 12 weeks | 2 weeks 6 days | - |
| Data retention time - minimum | 100 | - | - | 100 | 100 |
| Durability | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C control byte | 1010DMMR | - | - | 1010DMMR | 1010DMMR |
| JESD-609 code | e4 | - | e4 | e3 | - |
| length | 4.4 mm | - | 4.4 mm | 9.271 mm | 2 mm |
| Number of terminals | 8 | - | 8 | 8 | 8 |
| Encapsulate equivalent code | TSSOP8,.25 | - | - | DIP8,.3 | BGA8,2X4,40/20 |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 | NOT APPLICABLE | - |
| power supply | 1.8/5 V | - | - | 1.8/5 V | 1.8/5 V |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | - | 1.2 mm | 5.334 mm | 0.85 mm |
| Maximum standby current | 0.000001 A | - | - | 0.000001 A | 0.000001 A |
| Maximum slew rate | 0.003 mA | - | - | 0.003 mA | 0.003 mA |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | MATTE TIN | - |
| Terminal pitch | 0.65 mm | - | 0.65 mm | 2.54 mm | 0.5 mm |
| Maximum time at peak reflow temperature | 40 | - | 40 | NOT APPLICABLE | - |
| width | 3 mm | - | 3 mm | 7.62 mm | 1.5 mm |
| write protect | HARDWARE | - | - | HARDWARE | HARDWARE |
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