BZM5267D_R2_10001 datasheet, PDF

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BZM5267D_R2_10001: DescriptionZener Diode; CategoryDiscrete semiconductor diode; File Size573KB，7 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZM5267D_R2_10001 Overview

Zener Diode

BZM5267D_R2_10001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	O-LELF-R2
Reach Compliance Code	compliant
ECCN code	EAR99
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	270 Ω
Maximum forward voltage (VF)	1 V
JESD-30 code	O-LELF-R2
Maximum knee impedance	1700 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	75 V
Maximum reverse current	0.1 µA
Reverse test voltage	56 V
surface mount	YES
technology	ZENER
Terminal form	WRAP AROUND
Terminal location	END
Maximum voltage tolerance	20%
Working test current	1.7 mA
Base Number Matches	1

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BZM5221B SERIES

SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 75 Volts

POWER

500 mWatts

MICRO-MELF

Unit : inch (mm)

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

•

Lead free in comply with EU RoHS 2002/95/EC directives

.040(1.0)

.048(1.2)DIA.

MECHANICAL DATA

• Case: Molded Glass MICRO-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.008 grams

• Mounting Position: Any

• Packing information

T/R - 2.5K per 7" plastic Reel

.079(2.0)

.071(1.8)

.043(1.1)

.008(0.2)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Value

500

175

-65 to +175

Units

Parameter

Power Dissipation at Tamb = 25

Junction Temperature

Storage Temperature Range

Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.

Symbol

TOT

Parameter

Thermal Resi stance Juncti on to Ambi ent Ai r

Forward Voltage at I

= 200mA

Symbol

J A

Min.

Typ.

Max.

0.3

Uni ts

K/mW

Vali d provi ded that leads at a di stance of 8mm from case are kept at ambi ent temperature.

STAD-DEC.22.2008

PAGE . 1

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