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IPB05N03LA G |
IPB05N03LA |
IPI05N03LA |
IPP05N03LA |
IPB05N03LAT |
Description |
MOSFET N-CH 25V 80A D2PAK |
OptiMOS 2 Power-Transistor |
OptiMOS 2 Power-Transistor |
OptiMOS 2 Power-Transistor |
MOSFET N-CH 25V 80A D2PAK |
Is it Rohs certified? |
- |
incompatible |
conform to |
conform to |
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Parts packaging code |
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D2PAK |
TO-262AA |
TO-220AB |
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package instruction |
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PLASTIC, TO-263, 3 PIN |
IN-LINE, R-PSIP-T3 |
ROHS COMPLIANT, PLASTIC, TO-220, 3 PIN |
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Contacts |
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4 |
3 |
3 |
- |
Reach Compliance Code |
- |
compli |
compli |
compli |
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ECCN code |
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EAR99 |
EAR99 |
EAR99 |
- |
Other features |
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LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
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Avalanche Energy Efficiency Rating (Eas) |
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190 mJ |
190 mJ |
190 mJ |
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Configuration |
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SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
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Minimum drain-source breakdown voltage |
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25 V |
25 V |
25 V |
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Maximum drain current (Abs) (ID) |
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80 A |
80 A |
80 A |
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Maximum drain current (ID) |
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80 A |
80 A |
80 A |
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Maximum drain-source on-resistance |
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0.0078 Ω |
0.0081 Ω |
0.0081 Ω |
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FET technology |
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METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
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JEDEC-95 code |
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TO-263AB |
TO-262AA |
TO-220AB |
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JESD-30 code |
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R-PSSO-G2 |
R-PSIP-T3 |
R-PSFM-T3 |
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JESD-609 code |
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e0 |
e3 |
e3 |
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Number of components |
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1 |
1 |
1 |
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Number of terminals |
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2 |
3 |
3 |
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Operating mode |
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ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
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Maximum operating temperature |
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175 °C |
175 °C |
175 °C |
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Package body material |
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PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
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Package shape |
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RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
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Package form |
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SMALL OUTLINE |
IN-LINE |
FLANGE MOUNT |
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Peak Reflow Temperature (Celsius) |
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255 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Polarity/channel type |
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N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
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Maximum power dissipation(Abs) |
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94 W |
94 W |
94 W |
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Maximum pulsed drain current (IDM) |
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385 A |
385 A |
385 A |
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Certification status |
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Not Qualified |
Not Qualified |
Not Qualified |
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surface mount |
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YES |
NO |
NO |
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Terminal surface |
- |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) |
MATTE TIN |
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Terminal form |
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GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
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Terminal location |
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SINGLE |
SINGLE |
SINGLE |
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Maximum time at peak reflow temperature |
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NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
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transistor applications |
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SWITCHING |
SWITCHING |
SWITCHING |
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Transistor component materials |
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SILICON |
SILICON |
SILICON |
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