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MC68HC908MR8CDW

Description
IC MCU 8BIT 8KB FLASH 28SOIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size5MB,372 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC68HC908MR8CDW Overview

IC MCU 8BIT 8KB FLASH 28SOIC

MC68HC908MR8CDW Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
Parts packaging codeSOIC
package instructionSOP, SOP28,.4
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Has ADCYES
Address bus width
bit size8
CPU series68HC08
maximum clock frequency32.8 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length17.925 mm
Humidity sensitivity level1
Number of I/O lines12
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)220
power supply5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)8192
ROM programmabilityFLASH
Maximum seat height2.65 mm
speed8.2 MHz
Maximum slew rate40 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyHCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.5 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

MC68HC908MR8CDW Related Products

MC68HC908MR8CDW MC68HC908MR8CP MC68HC908MR8CFA MC908MR8MDWE MC68HC908MR8MFA MC68HC908MR8VFA MC68HC908MR8VDW MC68HC908MR8MP
Description IC MCU 8BIT 8KB FLASH 28SOIC IC MCU 8BIT 8KB FLASH 28DIP IC MCU 8BIT 8KB FLASH 32LQFP IC MCU 8BIT 8KB FLASH 28SOIC IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,QFP,32PIN,PLASTIC 8-BIT, FLASH, 8.2MHz, MICROCONTROLLER, PQFP32, LQFP-32 8-BIT, FLASH, 8.2MHz, MICROCONTROLLER, PDSO28, SOIC-28 IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,DIP,28PIN,PLASTIC
speed 8.2 MHz 8.2 MHz 8.2 MHz 8MHz 8.2 MHz 8.2 MHz 8.2 MHz 8.2 MHz
Is it Rohs certified? incompatible incompatible incompatible - incompatible incompatible incompatible incompatible
Maker NXP - - - NXP NXP NXP NXP
Parts packaging code SOIC DIP QFP - QFP QFP SOIC DIP
package instruction SOP, SOP28,.4 DIP, DIP28,.6 LQFP, QFP32,.35SQ,32 - LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32 SOP, SOP28,.4 DIP, DIP28,.6
Contacts 28 28 32 - 32 32 28 28
Reach Compliance Code unknown unknown not_compliant - not_compliant compliant unknown compliant
ECCN code EAR99 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99
Has ADC YES YES YES - YES YES YES YES
bit size 8 8 8 - 8 8 8 8
CPU series 68HC08 68HC08 68HC08 - 68HC08 68HC08 68HC08 68HC08
maximum clock frequency 32.8 MHz 32.8 MHz 32.8 MHz - 32.8 MHz 32.8 MHz 32.8 MHz 32.8 MHz
DAC channel NO NO NO - NO NO NO NO
DMA channel NO NO NO - NO NO NO NO
JESD-30 code R-PDSO-G28 R-PDIP-T28 S-PQFP-G32 - S-PQFP-G32 S-PQFP-G32 R-PDSO-G28 R-PDIP-T28
JESD-609 code e0 e0 e0 - e0 e0 e0 e0
length 17.925 mm 36.83 mm 7 mm - 7 mm 7 mm 17.925 mm 36.83 mm
Humidity sensitivity level 1 - 5A - 5A 5A 1 -
Number of I/O lines 12 12 16 - 16 16 12 12
Number of terminals 28 28 32 - 32 32 28 28
Maximum operating temperature 85 °C 85 °C 85 °C - 125 °C 105 °C 105 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES - YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP LQFP - LQFP LQFP SOP DIP
Encapsulate equivalent code SOP28,.4 DIP28,.6 QFP32,.35SQ,32 - QFP32,.35SQ,32 QFP32,.35SQ,32 SOP28,.4 DIP28,.6
Package shape RECTANGULAR RECTANGULAR SQUARE - SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) 220 NOT SPECIFIED 220 - 220 220 225 NOT APPLICABLE
power supply 5 V 5 V 5 V - 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 256 256 - 256 256 256 256
rom(word) 8192 8192 8192 - 8192 8192 8192 8192
ROM programmability FLASH FLASH FLASH - FLASH FLASH FLASH FLASH
Maximum seat height 2.65 mm 5.08 mm 1.6 mm - 1.6 mm 1.6 mm 2.65 mm 5.08 mm
Maximum slew rate 40 mA 40 mA 40 mA - 40 mA 40 mA 40 mA 40 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V - 5 V 5 V 5 V 5 V
surface mount YES NO YES - YES YES YES NO
technology HCMOS HCMOS HCMOS - HCMOS HCMOS HCMOS HCMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL - AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn80Pb20) - Tin/Lead (Sn80Pb20) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE GULL WING - GULL WING GULL WING GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 0.8 mm - 0.8 mm 0.8 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD - QUAD QUAD DUAL DUAL
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 - 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.5 mm 15.24 mm 7 mm - 7 mm 7 mm 7.5 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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