MC68HC908MR8MP datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> MC68HC908MR8MP

MC68HC908MR8MP: DescriptionIC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,DIP,28PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，372 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC68HC908MR8MP Overview

IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,DIP,28PIN,PLASTIC

MC68HC908MR8MP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	compliant
ECCN code	EAR99
Has ADC	YES
Address bus width
bit size	8
CPU series	68HC08
maximum clock frequency	32.8 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	36.83 mm
Number of I/O lines	12
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT APPLICABLE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	8192
ROM programmability	FLASH
Maximum seat height	5.08 mm
speed	8.2 MHz
Maximum slew rate	40 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	HCMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

MC68HC908MR8MP Related Products

	MC68HC908MR8MP	MC68HC908MR8CDW	MC68HC908MR8CP	MC68HC908MR8CFA	MC908MR8MDWE	MC68HC908MR8MFA	MC68HC908MR8VFA	MC68HC908MR8VDW
Description	IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,DIP,28PIN,PLASTIC	IC MCU 8BIT 8KB FLASH 28SOIC	IC MCU 8BIT 8KB FLASH 28DIP	IC MCU 8BIT 8KB FLASH 32LQFP	IC MCU 8BIT 8KB FLASH 28SOIC	IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,QFP,32PIN,PLASTIC	8-BIT, FLASH, 8.2MHz, MICROCONTROLLER, PQFP32, LQFP-32	8-BIT, FLASH, 8.2MHz, MICROCONTROLLER, PDSO28, SOIC-28
speed	8.2 MHz	8.2 MHz	8.2 MHz	8.2 MHz	8MHz	8.2 MHz	8.2 MHz	8.2 MHz
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	incompatible	incompatible	incompatible
Maker	NXP	NXP	-	-	-	NXP	NXP	NXP
Parts packaging code	DIP	SOIC	DIP	QFP	-	QFP	QFP	SOIC
package instruction	DIP, DIP28,.6	SOP, SOP28,.4	DIP, DIP28,.6	LQFP, QFP32,.35SQ,32	-	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	SOP, SOP28,.4
Contacts	28	28	28	32	-	32	32	28
Reach Compliance Code	compliant	unknown	unknown	not_compliant	-	not_compliant	compliant	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	-	EAR99	EAR99	EAR99
Has ADC	YES	YES	YES	YES	-	YES	YES	YES
bit size	8	8	8	8	-	8	8	8
CPU series	68HC08	68HC08	68HC08	68HC08	-	68HC08	68HC08	68HC08
maximum clock frequency	32.8 MHz	32.8 MHz	32.8 MHz	32.8 MHz	-	32.8 MHz	32.8 MHz	32.8 MHz
DAC channel	NO	NO	NO	NO	-	NO	NO	NO
DMA channel	NO	NO	NO	NO	-	NO	NO	NO
JESD-30 code	R-PDIP-T28	R-PDSO-G28	R-PDIP-T28	S-PQFP-G32	-	S-PQFP-G32	S-PQFP-G32	R-PDSO-G28
JESD-609 code	e0	e0	e0	e0	-	e0	e0	e0
length	36.83 mm	17.925 mm	36.83 mm	7 mm	-	7 mm	7 mm	17.925 mm
Number of I/O lines	12	12	12	16	-	16	16	12
Number of terminals	28	28	28	32	-	32	32	28
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	-	125 °C	105 °C	105 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	-	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	LQFP	-	LQFP	LQFP	SOP
Encapsulate equivalent code	DIP28,.6	SOP28,.4	DIP28,.6	QFP32,.35SQ,32	-	QFP32,.35SQ,32	QFP32,.35SQ,32	SOP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	-	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT APPLICABLE	220	NOT SPECIFIED	220	-	220	220	225
power supply	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256	256	-	256	256	256
rom(word)	8192	8192	8192	8192	-	8192	8192	8192
ROM programmability	FLASH	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH
Maximum seat height	5.08 mm	2.65 mm	5.08 mm	1.6 mm	-	1.6 mm	1.6 mm	2.65 mm
Maximum slew rate	40 mA	40 mA	40 mA	40 mA	-	40 mA	40 mA	40 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	-	YES	YES	YES
technology	HCMOS	HCMOS	HCMOS	HCMOS	-	HCMOS	HCMOS	HCMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn80Pb20)	-	Tin/Lead (Sn80Pb20)	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	-	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	0.8 mm	-	0.8 mm	0.8 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	-	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	30	NOT SPECIFIED	30	-	30	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	7.5 mm	15.24 mm	7 mm	-	7 mm	7 mm	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Humidity sensitivity level	-	1	-	5A	-	5A	5A	1

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