QTE-060-07-L-D-A datasheet, PDF

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QTE-060-07-L-D-A: Description.8MM DOUBLE ROW MI TERMINAL ASSE; CategoryThe connector The connector; File Size974KB，1 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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QTE-060-07-L-D-A Overview

.8MM DOUBLE ROW MI TERMINAL ASSE

QTE-060-07-L-D-A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Factory Lead Time	3 weeks
Other features	E.L.P., POLARIZED
Board mount options	POSITIONING PIN
body width	0.235 inch
subject depth	0.954 inch
body length	2.362 inch
Connector type	BOARD STACKING CONNECTOR
Contact to complete cooperation	GOLD (10) OVER NICKEL (50)
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	NOT SPECIFIED
contact mode	RECTANGULAR
Contact style	CENTRONIC
DIN compliance	NO
Durability	100 Cycles
Filter function	NO
IEC compliance	NO
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e3
MIL compliance	NO
Plug contact pitch	0.031 inch
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Options	GENERAL PURPOSE
PCB contact pattern	RECTANGULAR
PCB contact row spacing	6.096 mm
Plating thickness	10u inch
polarization key	POLARIZED HOUSING
Rated current (signal)	1.3 A
Guideline	UL, CSA
reliability	COMMERCIAL
Terminal pitch	0.8 mm
Termination type	SURFACE MOUNT
Total number of contacts	120

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F-219

QTE–014–01–F–D–DP–A

QTE–040–01–L–D–A

QTE–060–01–L–D–A

(0.80 mm) .0315"

QTE SERIES

HIGH-SPEED GROUND PLANE HEADER

SPECIFICATIONS

For complete specifications and

recommended PCB layouts see

www.samtec.com?QTE

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Plating:

Au or Sn over

50 µ" (1.27 µm) Ni

Current Rating:

Contact:

2 A per pin

(2 pins powered)

Ground Plane:

23 A per ground plane

(1 ground plane powered)

Operating Temp Range:

-55 °C to +125 °C

Voltage Rating:

225 VAC mated with QSE

& 5 mm Stack Height

Max Cycles:

100

RoHS Compliant:

Yes

Board Mates:

QSE

Cable Mates:

EQCD, EQDP

(See Also Available Note)

Standoffs:

Integral metal plane

for power or ground

Standard stack heights

from 5 mm to 25 mm

POWER/SIGNAL

APPLICATION

HIGH-SPEED CHANNEL PERFORMANCE

QTE-D/QSE-D or QTE-DP/QSE-DP

@ 5 mm Mated Stack Height

Rating based on Samtec reference

channel.For full SI performance

data visit Samtec.comor contact

SIG@samtec.com

QTE-D/QSE-D

Compatible with

UMPT/UMPS for flexible

two-piece power/signal solutions

14 28

G b p s

QTE-DP/QSE-DP

EXTENDED LIFE

PRODUCT

HIGH MATING

CYCLES

10 YEAR MFG

WITH 50 µ" GOLD

PROCESSING

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0.10 mm) .004" max (020-060)

Board Stacking:

For applications requiring

more than two connectors per

board contact ipg@samtec.com

QTE

PINS PER ROW

NO. OF PAIRS

LEAD

STYLE

Specify

LEAD

STYLE

from

chart

PLATING

OPTION

TYPE

OTHER

OPTION

1-DH1

(40 total pins per bank = –D)

–020, –040, –060

–014, –028, –042

(14 pairs per bank = –D–DP)

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

= Gold Flash on

Signal Pins and

Ground Plane,

Matte Tin on tails

= 10 µ" (0.25 µm)

Gold on Signal Pins

and Ground Plane,

Matte Tin on tails

–F

= Single-Ended

–D

–L

= Differential Pair

(–01 only)

–D–DP

= (7.00 mm)

.275" DIA

Polyimide

Film Pick &

Place Pad

–K

–D–DP = (No. of Positions per Row/14)

x (20.00) .7875

FILE NO. E111594

ALSO AVAILABLE

(MOQ Required)

• 15 mm, 22 mm and

30 mm stack height

• 30 µ" (0.76 µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

• Edge Mount, Guide Posts,

Screw Down & Friction Lock

• 56 (-DP), 80, 100

positions per row

• Retention Option

–D = (No. of Positions per Row/20)

x (20.00) .7875

(20.00) .7875

= Tape & Reel

Packaging

(N/A –05 & –07

lead style)

–TR

(5.97)

.235

(0.80)

.0315

(0.20)

.008

= Electro-Polished

Selective

(7.11)

.280

50 µ" (1.27 µm) min

Au over 150µ"

(3.81 µm) Ni on Signal

Pins in contact area,

10 µ" (0.25 µm) min

Au over 50 µ" (1.27 µm)

Ni on Ground Plane

in contact area,

Matte Tin over 50µ"

(1.27 µm) min Ni on

all solder tails

*Note:

–C Plating passes

10 year MFG testing

–C*

= Latching

Option

(N/A on –042 &

–060 positions)

QTE

LEAD

STYLE

–L

(4.27) .168

(7.26) .286

HEIGHT

WITH QSE*

(5.00) .197

(8.00) .315

(0.76)

.030

(0.89)

.035 DIA

(0.64)

.025

–01

–02

–03

–04

–05

–07

–09

(10.27) .404 (11.00) .433

(15.25) .600 (16.00) .630

(18.26) .718 (19.00) .748

(24.24) .954 (25.00) .984

(13.26) .522 (14.00) .551

Note:

Some lengths, styles and

options are non-standard,

non-returnable.

–L

*Processing conditions will affect

mated height. See SO Series for

board space tolerances

Due to technical progress, all designs, specifications and components are subject to change without notice.

All parts within this catalog are built to Samtec’s specifications.

Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.

WWW.SAMTEC.COM

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