|
74HCT157N,652 |
74HC157N,652 |
Description |
IC MULTIPLEXER QUAD 2INPUT 16DIP |
IC QUAD 2-IN MUX 16DIP |
Brand Name |
NXP Semiconductor |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
conform to |
Maker |
NXP |
NXP |
Parts packaging code |
DIP |
DIP |
package instruction |
0.300 INCH, PLASTIC, SOT38-4, DIP-16 |
0.300 INCH, PLASTIC, SOT38-4, DIP-16 |
Contacts |
16 |
16 |
Manufacturer packaging code |
SOT38-4 |
SOT38-4 |
Reach Compliance Code |
compliant |
compliant |
Is Samacsys |
N |
N |
series |
HCT |
HC/UH |
JESD-30 code |
R-PDIP-T16 |
R-PDIP-T16 |
length |
21.6 mm |
21.6 mm |
Load capacitance (CL) |
50 pF |
50 pF |
Logic integrated circuit type |
MULTIPLEXER |
MULTIPLEXER |
MaximumI(ol) |
0.004 A |
0.004 A |
Number of functions |
4 |
4 |
Number of entries |
2 |
2 |
Output times |
1 |
1 |
Number of terminals |
16 |
16 |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Output polarity |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
Encapsulate equivalent code |
DIP16,.3 |
DIP16,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
method of packing |
TUBE |
BULK PACK |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
5 V |
2/6 V |
Prop。Delay @ Nom-Sup |
41 ns |
38 ns |
propagation delay (tpd) |
56 ns |
38 ns |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
4.7 mm |
4.7 mm |
Maximum supply voltage (Vsup) |
5.5 V |
6 V |
Minimum supply voltage (Vsup) |
4.5 V |
2 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
width |
7.62 mm |
7.62 mm |
Base Number Matches |
1 |
1 |