|
IS43TR16512B-125KBL |
IS43TR16512B-125KBLI |
IS43TR16512BL-125KBL |
IS43TR16512BL-125KBLI |
Description |
IC DRAM 8G PARALLEL 96FBGA |
IC DRAM 8G PARALLEL 96FBGA |
IC DRAM 8G PARALLEL 96FBGA |
IC DRAM 8G PARALLEL 96FBGA |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
ISSI(Integrated Silicon Solution Inc.) |
ISSI(Integrated Silicon Solution Inc.) |
ISSI(Integrated Silicon Solution Inc.) |
ISSI(Integrated Silicon Solution Inc.) |
package instruction |
TFBGA, |
TFBGA, |
TFBGA, |
TFBGA, |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
8 weeks |
8 weeks |
8 weeks |
8 weeks |
Is Samacsys |
N |
N |
N |
N |
access mode |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
JESD-30 code |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
length |
14 mm |
14 mm |
14 mm |
14 mm |
memory density |
8589934592 bit |
8589934592 bit |
8589934592 bit |
8589934592 bit |
Memory IC Type |
DDR DRAM |
DDR DRAM |
DDR DRAM |
DDR DRAM |
memory width |
16 |
16 |
16 |
16 |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
Number of terminals |
96 |
96 |
96 |
96 |
word count |
536870912 words |
536870912 words |
536870912 words |
536870912 words |
character code |
512000000 |
512000000 |
512000000 |
512000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
95 °C |
95 °C |
95 °C |
95 °C |
organize |
512MX16 |
512MX16 |
512MX16 |
512MX16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TFBGA |
TFBGA |
TFBGA |
TFBGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
self refresh |
YES |
YES |
YES |
YES |
Maximum supply voltage (Vsup) |
1.575 V |
1.575 V |
1.45 V |
1.45 V |
Minimum supply voltage (Vsup) |
1.425 V |
1.425 V |
1.283 V |
1.283 V |
Nominal supply voltage (Vsup) |
1.5 V |
1.5 V |
1.35 V |
1.35 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
OTHER |
INDUSTRIAL |
OTHER |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
10 |
10 |
10 |
10 |
width |
10 mm |
10 mm |
10 mm |
10 mm |
Base Number Matches |
1 |
1 |
1 |
1 |