FTE-116-02-G-DV-A-P datasheet, PDF

Datasheet> All Categories > The connector> The connector> FTE-116-02-G-DV-A-P

FTE-116-02-G-DV-A-P: Description.8MM MICRO TERMINAL STRIP; CategoryThe connector The connector; File Size799KB，1 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

Download Datasheet Parametric View All

FTE-116-02-G-DV-A-P Overview

.8MM MICRO TERMINAL STRIP

FTE-116-02-G-DV-A-P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	2 weeks
Other features	W/ALIGNMENT PIN,PICK&PLACE PAD
Board mount options	POSITIONING PIN
body width	0.164 inch
subject depth	0.055 inch
body length	0.504 inch
Body/casing type	RECEPTACLE
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD FLASH OVER NICKEL (50)
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact style	SQ PIN-SKT
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code	e4
Plug contact pitch	0.031 inch
Match contact row spacing	0.047 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	125 °C
Minimum operating temperature	-65 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	3.302 mm
Plating thickness	10u inch
Rated current (signal)	0.75 A
Guideline	UL
reliability	COMMERCIAL
Terminal length
Terminal pitch	0.7874 mm
Termination type	SURFACE MOUNT
Total number of contacts	32
Evacuation force-minimum value	4.448 N
Base Number Matches	1

Preview

Download Datasheet

View All

F-219

FTE–155–01–G–DV

FTE–120–01–G–DV–A

FTE–130–01–G–DV–ES

(0.80 mm) .0315"

FTE SERIES

SMT MICRO HEADER

SPECIFICATIONS

For complete specifications and

recommended PCB layouts

see www.samtec.com?FTE

Insulator Material:

Black Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Plating:

Au over 50 µ" (1.27 µm) Ni

Current Rating (FTE/CLE):

2.7 A per pin

(2 pins powered)

Operating Temp Range:

-55 °C to +125 °C

RoHS Compliant:

Yes

Mates with:

CLE

Choice of

post heights

Low profile

(1.70 mm)

.067"

OPTIONS

–P OPTION

Surface

Mount

PROCESSING

Lead-Free Solderable:

Yes

-DV Lead Coplanarity:

(0.10 mm) .004" max

-DH Lead Coplanarity:

(0.10 mm) .004" max (05-25)

(0.15 mm) .006" max (26-50)*

*(.004" stencil solution

may be available; contact

IPG@samtec.com)

–ES OPTION

–TR OPTION

Optional

End Shrouds

for blind mating

(0.80 mm) .0315"

micro pitch

FTE

RECOGNITIONS

For complete scope of

recognitions see

www.samtec.com/quality

FILE NO. E111594

NO.

PER PINS

ROW

LEAD

STYLE

Specify

LEAD

STYLE

from

chart

PLATING

OPTION

TAIL

OPTION

FLEX SHROUD

OPTIONS

Style –01 –DV only

(11 pins/row min.)

OTHER

OPTION

05 thru 90

= 10 µ"

(0.25 µm)

Gold on post,

Gold flash on

balance

–G

= Dual

Vertical

–DV

= Dual

Horizontal

(50 pos.

max.)

–DH

= End Shroud

–ES

No. of positions x (0.80) .0315

(0.80) .0315

180

LEAD

STYLE

(1.90)

.075

(4.45)

.175

(3.05)

.120

= End Shroud with

Locking Clips

(Manual placement

required)

–EC

= Alignment

(5 pos. min.)

Metal or

plastic at

Samtec

discretion

(–DV only)

–A

(3.05)

.120

(1.20)

.047

179

–01

–02

–03

OPTION

= End Shroud with

Guide Posts

–EP

(1.57)

.062

(4.11)

.162

(5.51)

.217

(5.08)

.200

= (2.50 mm)

.098" DIA

Polyimide

Film Pick &

Place Pad

(–DH only)

= Plastic Pick

& Place Pad

(8 pos. min.)

–DV only

–K

ALSO AVAILABLE

(MOQ Required)

• End shrouds with

board locks

• Gold flash plating

–ES

–EC

No. of positions x

(0.80) .0315 +

(0.30) .012 SQ

–P

–EP

(2.29)

.090

–DH OPTION

(4.17)

.164

(5.08) .200

(3.18) .125

= Tape & Reel

Packaging

–TR

(1.38)

.055

Note:

Some lengths,

styles and options are

non-standard, non-returnable.

(Shrouded options removed for clarity)

(1.70)

.067

(4.57)

.180

(3.18)

(4.09) .125

.161

–ES OPTION

–P OPTION

Due to technical progress, all designs, specifications and components are subject to change without notice.

All parts within this catalog are built to Samtec’s specifications.

Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.

WWW.SAMTEC.COM

Recommended Resources

How to ensure that the power supply works for a long time—PA power analyzer

Principle circuit of current switching class D amplifier

Sensing signal measurement - 4 to 20mA current converter

Transistor controlled rectifier circuit c

Decorative painting and sound installation

555 high performance street light electrical control circuit

Please help me explain this circuit schematic, how it works, and where each module is.: Please take a look...; 中科绿能 Circuit Observation Room

How to use printf for debugging: I just came into contact with TI chips, and I used the tms320f28069 chip. Now I use the ccs6 tool. I want to use printf debugging. How should I do it? If there is a great god who can solve it, please ...; wuyue123 Microcontroller MCU

Comparison between Internal PA and External FEM: In the Wi-Fi wireless radio architecture, there are three main key components that determine the performance of the Wi-Fi system, namely the Wi-Fi radio chip (Wi-Fi Chipset), front-end radio component...; alan000345 RF/Wirelessly

When studying (100 examples of single-chip C language programming practice), I encountered a problem with undefined identifiers. Please tell me how to solve it!: 100 examples of single-chip C language programming practice - based on 8051 + Proteus simulation (2nd edition)04 1602LCD displays the key characters of the mobile phone keyboard. Compile with Keil C51...; wang5825 51mcu

Ramtron launches 8051 MCU with embedded FRAM: RamtronInternational发布全球第一款嵌入了非易失性FRAM存储器的8051MCU—VRS51L3074。Ramtron将FRAM加入于其高速灵活的Versa8051系列产品中，以实现设计高速及高可靠性的非易失性数据存储和处理系统，而该系统只有嵌入了FRAM的增强型微控制器才能提供。 VRS51L3074将8KBFRAM存储器和高性能系统级芯片结合，其核心是速度高达40MIPS单周...; rain 51mcu

NCP1252: What does Lmag stand for on page 16 of the NCP1252 chip manual?...; soumns丶涛 Power technology

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components