250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | ON Semiconductor |
Parts packaging code | TO-92 |
package instruction | CYLINDRICAL, O-PBCY-T3 |
Contacts | 3 |
Manufacturer packaging code | CASE 29-11 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 200 V |
Maximum drain current (Abs) (ID) | 0.13 A |
Maximum drain current (ID) | 0.25 A |
Maximum drain-source on-resistance | 14 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-226AA |
JESD-30 code | O-PBCY-T3 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | ROUND |
Package form | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 1 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
BS107RLRA | BS107_04 | BS107ARLRM | BS107ARLRP | BS107RL1 | |
---|---|---|---|---|---|
Description | 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA | 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA | 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA | 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA | 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA |
Number of components | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 | 3 |
Terminal form | THROUGH-HOLE | THROUGH-hole | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
transistor applications | SWITCHING | switch | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | silicon | SILICON | SILICON | SILICON |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible |
Maker | ON Semiconductor | - | ON Semiconductor | ON Semiconductor | ON Semiconductor |
Parts packaging code | TO-92 | - | TO-92 | TO-92 | TO-92 |
package instruction | CYLINDRICAL, O-PBCY-T3 | - | CASE 29-11, TO-92, 3 PIN | CASE 29-11, TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 |
Contacts | 3 | - | 3 | 3 | 3 |
Manufacturer packaging code | CASE 29-11 | - | CASE 29-11 | CASE 29-11 | CASE 29-11 |
Reach Compliance Code | _compli | - | _compli | _compli | _compli |
ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 |
Configuration | SINGLE WITH BUILT-IN DIODE | - | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 200 V | - | 200 V | 200 V | 200 V |
Maximum drain current (Abs) (ID) | 0.13 A | - | 0.25 A | 0.25 A | 0.25 A |
Maximum drain current (ID) | 0.25 A | - | 0.25 A | 0.25 A | 0.25 A |
Maximum drain-source on-resistance | 14 Ω | - | 6.4 Ω | 6.4 Ω | 14 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | - | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-226AA | - | TO-226AA | TO-226AA | TO-226AA |
JESD-30 code | O-PBCY-T3 | - | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 |
JESD-609 code | e0 | - | e0 | e0 | e0 |
Operating mode | ENHANCEMENT MODE | - | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C | - | 150 °C | 150 °C | 150 °C |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | ROUND | - | ROUND | ROUND | ROUND |
Package form | CYLINDRICAL | - | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL | - | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Maximum power dissipation(Abs) | 1 W | - | 0.35 W | 0.6 W | 0.35 W |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | - | NO | NO | NO |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |