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HEF4051BTT

Description
Multiplexer Switch ICs
CategoryAnalog mixed-signal IC    The signal circuit   
File Size845KB,22 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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HEF4051BTT Overview

Multiplexer Switch ICs

HEF4051BTT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instruction4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Contacts16
Reach Compliance Codecompliant
Analog Integrated Circuits - Other TypesSINGLE-ENDED MULTIPLEXER
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length5 mm
Humidity sensitivity level1
Number of channels8
Number of functions1
Number of terminals16
Nominal off-state isolation50 dB
On-state resistance matching specifications25 Ω
Maximum on-state resistance (Ron)2500 Ω
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply5/15 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum signal current0.01 A
Maximum supply current (Isup)0.6 mA
Maximum supply voltage (Vsup)15 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
Maximum disconnect time240 ns
Maximum connection time280 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1

HEF4051BTT Related Products

HEF4051BTT HEF4051BTT,118 HEF4051BTS,112 HEF4051BT/AUJ HEF4051BT
Description Multiplexer Switch ICs Multiplexer Switch ICs 8-CH ANLG MUX/DEMUX Multiplexer Switch ICs 8-CHANNEL MUX/DEMUX Multiplexer Switch ICs 8-channel analog multiplxr/demultplxr Multiplexer Switch ICs
Is it Rohs certified? conform to conform to conform to - conform to
Maker NXP NXP NXP - NXP
Parts packaging code TSSOP TSSOP SSOP1 - SOIC
package instruction 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 - 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
Contacts 16 16 16 - 16
Reach Compliance Code compliant compliant compliant - compliant
Analog Integrated Circuits - Other Types SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER - SINGLE-ENDED MULTIPLEXER
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 - R-PDSO-G16
length 5 mm 5 mm 6.2 mm - 9.9 mm
Humidity sensitivity level 1 1 1 - 1
Number of channels 8 8 8 - 8
Number of functions 1 1 1 - 1
Number of terminals 16 16 16 - 16
Nominal off-state isolation 50 dB 50 dB 50 dB - 50 dB
On-state resistance matching specifications 25 Ω 5 Ω 5 Ω - 25 Ω
Maximum on-state resistance (Ron) 2500 Ω 175 Ω 175 Ω - 2500 Ω
Maximum operating temperature 125 °C 85 °C 85 °C - 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code TSSOP TSSOP SSOP - SOP
Encapsulate equivalent code TSSOP16,.25 TSSOP16,.25 SSOP16,.3 - SOP16,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH - SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 - 260
power supply 5/15 V 5/15 V 5/15 V - 5/15 V
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 1.1 mm 1.1 mm 2 mm - 1.75 mm
Maximum signal current 0.01 A 0.01 A 0.01 A - 0.01 A
Maximum supply current (Isup) 0.6 mA 0.6 mA 0.6 mA - 0.6 mA
Maximum supply voltage (Vsup) 15 V 15 V 15 V - 15 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V - 3 V
Nominal supply voltage (Vsup) 5 V 15 V 15 V - 5 V
surface mount YES YES YES - YES
Maximum disconnect time 240 ns 230 ns 230 ns - 240 ns
Maximum connection time 280 ns 80 ns 80 ns - 280 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE
technology CMOS CMOS CMOS - CMOS
Temperature level AUTOMOTIVE INDUSTRIAL INDUSTRIAL - AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD - NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal form GULL WING GULL WING GULL WING - GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm - 1.27 mm
Terminal location DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 30 - 30
width 4.4 mm 4.4 mm 5.3 mm - 3.9 mm
Base Number Matches 1 1 1 - 1
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