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HEF4051BTT,118

Description
Multiplexer Switch ICs 8-CH ANLG MUX/DEMUX
CategoryAnalog mixed-signal IC    The signal circuit   
File Size845KB,22 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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HEF4051BTT,118 Overview

Multiplexer Switch ICs 8-CH ANLG MUX/DEMUX

HEF4051BTT,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instruction4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Contacts16
Manufacturer packaging codeSOT403-1
Reach Compliance Codecompliant
Analog Integrated Circuits - Other TypesSINGLE-ENDED MULTIPLEXER
JESD-30 codeR-PDSO-G16
length5 mm
Humidity sensitivity level1
Number of channels8
Number of functions1
Number of terminals16
Nominal off-state isolation50 dB
On-state resistance matching specifications5 Ω
Maximum on-state resistance (Ron)175 Ω
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply5/15 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum signal current0.01 A
Maximum supply current (Isup)0.6 mA
Maximum supply voltage (Vsup)15 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)15 V
surface mountYES
Maximum disconnect time230 ns
Maximum connection time80 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1

HEF4051BTT,118 Related Products

HEF4051BTT,118 HEF4051BTS,112 HEF4051BT/AUJ HEF4051BTT HEF4051BT
Description Multiplexer Switch ICs 8-CH ANLG MUX/DEMUX Multiplexer Switch ICs 8-CHANNEL MUX/DEMUX Multiplexer Switch ICs 8-channel analog multiplxr/demultplxr Multiplexer Switch ICs Multiplexer Switch ICs
Is it Rohs certified? conform to conform to - conform to conform to
Maker NXP NXP - NXP NXP
Parts packaging code TSSOP SSOP1 - TSSOP SOIC
package instruction 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 - 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
Contacts 16 16 - 16 16
Reach Compliance Code compliant compliant - compliant compliant
Analog Integrated Circuits - Other Types SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER - SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 code R-PDSO-G16 R-PDSO-G16 - R-PDSO-G16 R-PDSO-G16
length 5 mm 6.2 mm - 5 mm 9.9 mm
Humidity sensitivity level 1 1 - 1 1
Number of channels 8 8 - 8 8
Number of functions 1 1 - 1 1
Number of terminals 16 16 - 16 16
Nominal off-state isolation 50 dB 50 dB - 50 dB 50 dB
On-state resistance matching specifications 5 Ω 5 Ω - 25 Ω 25 Ω
Maximum on-state resistance (Ron) 175 Ω 175 Ω - 2500 Ω 2500 Ω
Maximum operating temperature 85 °C 85 °C - 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP - TSSOP SOP
Encapsulate equivalent code TSSOP16,.25 SSOP16,.3 - TSSOP16,.25 SOP16,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 - 260 260
power supply 5/15 V 5/15 V - 5/15 V 5/15 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.1 mm 2 mm - 1.1 mm 1.75 mm
Maximum signal current 0.01 A 0.01 A - 0.01 A 0.01 A
Maximum supply current (Isup) 0.6 mA 0.6 mA - 0.6 mA 0.6 mA
Maximum supply voltage (Vsup) 15 V 15 V - 15 V 15 V
Minimum supply voltage (Vsup) 3 V 3 V - 3 V 3 V
Nominal supply voltage (Vsup) 15 V 15 V - 5 V 5 V
surface mount YES YES - YES YES
Maximum disconnect time 230 ns 230 ns - 240 ns 240 ns
Maximum connection time 80 ns 80 ns - 280 ns 280 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal form GULL WING GULL WING - GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm - 0.65 mm 1.27 mm
Terminal location DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 30 - 30 30
width 4.4 mm 5.3 mm - 4.4 mm 3.9 mm
Base Number Matches 1 1 - 1 1
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