GS8322Z72GC-166V datasheet, PDF

GS8322Z72GC-166V: DescriptionSRAM 1.8/2.5V 512K x 72 36M; Categorystorage storage; File Size419KB，28 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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SRAM 1.8/2.5V 512K x 72 36M

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	209
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Factory Lead Time	8 weeks
Maximum access time	8 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 code	R-PBGA-B209
JESD-609 code	e1
length	22 mm
memory density	37748736 bit
Memory IC Type	ZBT SRAM
memory width	72
Humidity sensitivity level	3
Number of functions	1
Number of terminals	209
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX72
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	2 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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