|
MC74HC4066AD |
MC74HC4066ADTR2 |
MC74HC4066AN |
Description |
Multiplexer Switch ICs 2-12V Quad Mux/Demux |
Multiplexer Switch ICs 2-12V Quad Mux/Demux |
Multiplexer Switch ICs 2-12V Quad Mux/Demux |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Parts packaging code |
SOIC |
TSSOP |
DIP |
package instruction |
SOP, SOP14,.25 |
TSSOP, TSSOP14,.25 |
DIP, DIP14,.3 |
Contacts |
14 |
14 |
14 |
Reach Compliance Code |
not_compliant |
unknown |
not_compliant |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDIP-T14 |
JESD-609 code |
e0 |
e4 |
e0 |
length |
8.65 mm |
5 mm |
18.86 mm |
normal position |
NO |
NO |
NO |
Number of channels |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
Number of terminals |
14 |
14 |
14 |
Nominal off-state isolation |
40 dB |
40 dB |
40 dB |
On-state resistance matching specifications |
20 Ω |
20 Ω |
20 Ω |
Maximum on-state resistance (Ron) |
120 Ω |
120 Ω |
120 Ω |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
TSSOP |
DIP |
Encapsulate equivalent code |
SOP14,.25 |
TSSOP14,.25 |
DIP14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
Peak Reflow Temperature (Celsius) |
240 |
260 |
235 |
power supply |
2/12 V |
2/12 V |
2/12 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.2 mm |
4.69 mm |
Maximum supply voltage (Vsup) |
12 V |
12 V |
12 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
NO |
Maximum disconnect time |
60 ns |
60 ns |
60 ns |
Maximum connection time |
45 ns |
45 ns |
45 ns |
switch |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
0.65 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
40 |
NOT SPECIFIED |
width |
3.9 mm |
4.4 mm |
7.62 mm |
ECCN code |
EAR99 |
- |
EAR99 |
Humidity sensitivity level |
1 |
1 |
- |