GS78132B-12I datasheet, PDF - EEWORLD Datasheet

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GS78132B-12I: Description256K x 32 8Mb Asynchronous SRAM; Categorystorage storage; File Size227KB，11 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS78132B-12I Overview

256K x 32 8Mb Asynchronous SRAM

GS78132B-12I Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	BGA,
Contacts	119
Reach Compliance Code	compli
ECCN code	3A991.B.2.B
Maximum access time	12 ns
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	8388608 bi
Memory IC Type	STANDARD SRAM
memory width	32
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX32
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

GS78132B-12I Related Products

	GS78132B-12I	GS78132B	GS78132B-10	GS78132B-12	GS78132B-15	GS78132B-15I	GS78132B-10I
Description	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM	256K x 32 8Mb Asynchronous SRAM
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	GSI Technology	-	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
Parts packaging code	BGA	-	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	-	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	119	-	119	119	119	119	119
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli
ECCN code	3A991.B.2.B	-	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	12 ns	-	10 ns	12 ns	15 ns	15 ns	10 ns
JESD-30 code	R-PBGA-B119	-	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
JESD-609 code	e0	-	e0	e0	e0	e0	e0
length	22 mm	-	22 mm	22 mm	22 mm	22 mm	22 mm
memory density	8388608 bi	-	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	32	-	32	32	32	32	32
Humidity sensitivity level	3	-	3	3	3	3	3
Number of functions	1	-	1	1	1	1	1
Number of terminals	119	-	119	119	119	119	119
word count	262144 words	-	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	-	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	70 °C	70 °C	70 °C	85 °C	85 °C
organize	256KX32	-	256KX32	256KX32	256KX32	256KX32	256KX32
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	-	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.4 mm	-	2.4 mm	2.4 mm	2.4 mm	2.4 mm	2.4 mm
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	-	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	-	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	-	14 mm	14 mm	14 mm	14 mm	14 mm

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