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GS78132B

Description
256K x 32 8Mb Asynchronous SRAM
File Size227KB,11 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
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GS78132B Overview

256K x 32 8Mb Asynchronous SRAM

GS78132B Related Products

GS78132B GS78132B-10 GS78132B-12 GS78132B-15 GS78132B-15I GS78132B-12I GS78132B-10I
Description 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM 256K x 32 8Mb Asynchronous SRAM
Is it lead-free? - Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible
Maker - GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology
Parts packaging code - BGA BGA BGA BGA BGA BGA
package instruction - BGA, BGA, BGA, BGA, BGA, BGA,
Contacts - 119 119 119 119 119 119
Reach Compliance Code - compli compli compli compli compli compli
ECCN code - 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time - 10 ns 12 ns 15 ns 15 ns 12 ns 10 ns
JESD-30 code - R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119
JESD-609 code - e0 e0 e0 e0 e0 e0
length - 22 mm 22 mm 22 mm 22 mm 22 mm 22 mm
memory density - 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi 8388608 bi
Memory IC Type - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width - 32 32 32 32 32 32
Humidity sensitivity level - 3 3 3 3 3 3
Number of functions - 1 1 1 1 1 1
Number of terminals - 119 119 119 119 119 119
word count - 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code - 256000 256000 256000 256000 256000 256000
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
organize - 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - BGA BGA BGA BGA BGA BGA
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 2.4 mm 2.4 mm 2.4 mm 2.4 mm 2.4 mm 2.4 mm
Maximum supply voltage (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES YES YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form - BALL BALL BALL BALL BALL BALL
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

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