256K x 32 8Mb Asynchronous SRAM
GS78132B | GS78132B-10 | GS78132B-12 | GS78132B-15 | GS78132B-15I | GS78132B-12I | GS78132B-10I | |
---|---|---|---|---|---|---|---|
Description | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM | 256K x 32 8Mb Asynchronous SRAM |
Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | - | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
Parts packaging code | - | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | - | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
Contacts | - | 119 | 119 | 119 | 119 | 119 | 119 |
Reach Compliance Code | - | compli | compli | compli | compli | compli | compli |
ECCN code | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
Maximum access time | - | 10 ns | 12 ns | 15 ns | 15 ns | 12 ns | 10 ns |
JESD-30 code | - | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 |
JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 |
length | - | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
memory density | - | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
Memory IC Type | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | - | 32 | 32 | 32 | 32 | 32 | 32 |
Humidity sensitivity level | - | 3 | 3 | 3 | 3 | 3 | 3 |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | - | 119 | 119 | 119 | 119 | 119 | 119 |
word count | - | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | - | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
organize | - | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | BGA | BGA | BGA | BGA | BGA | BGA |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | - | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm |
Maximum supply voltage (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | - | YES | YES | YES | YES | YES | YES |
technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | - | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | - | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |