Logic Gates 5V Triple 3-Input NAND
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ON Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| Factory Lead Time | 1 week |
| series | ACT |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e3 |
| length | 18.86 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.024 A |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| propagation delay (tpd) | 10 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 4.69 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 7.62 mm |
| MC74ACT10NG | MC74ACT10MEL | MC74ACT10DR2 | MC74AC10NG | MC74AC10D | MC74ACT10DTR2 | |
|---|---|---|---|---|---|---|
| Description | Logic Gates 5V Triple 3-Input NAND | Logic Gates 5V Triple 3-Input | Logic Gates 5V Triple 3-Input | Logic Gates 2-6V Triple 3-Input NAND | Logic Gates 2-6V Triple 3-Input | Logic Gates 5V Triple 3-Input |
| Is it Rohs certified? | conform to | conform to | incompatible | conform to | incompatible | conform to |
| Parts packaging code | DIP | SOIC | SOIC | DIP | SOIC | TSSOP |
| package instruction | DIP, DIP14,.3 | SOP, SOP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | SOP, SOP14,.25 | LEAD FREE, TSSOP-14 |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | not_compliant | unknown | not_compliant | unknown |
| series | ACT | ACT | ACT | AC | AC | ACT |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e3 | e4 | e0 | e3 | e0 | e4 |
| length | 18.86 mm | 10.2 mm | 8.65 mm | 18.86 mm | 8.65 mm | 5 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of entries | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP | DIP | SOP | TSSOP |
| Encapsulate equivalent code | DIP14,.3 | SOP14,.3 | SOP14,.25 | DIP14,.3 | SOP14,.25 | TSSOP14,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | 240 | 260 | 240 | 260 |
| power supply | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 10 ns | 10.5 ns | 10.5 ns | 10 ns |
| propagation delay (tpd) | 10 ns | 10 ns | 10 ns | 10.5 ns | 10.5 ns | 10 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| Maximum seat height | 4.69 mm | 2.05 mm | 1.75 mm | 4.69 mm | 1.75 mm | 1.2 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 6 V | 6 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 2 V | 2 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin (Sn) | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED | 30 | 40 | 30 | 40 |
| width | 7.62 mm | 5.275 mm | 3.9 mm | 7.62 mm | 3.9 mm | 4.4 mm |
| Maker | ON Semiconductor | ON Semiconductor | - | ON Semiconductor | ON Semiconductor | ON Semiconductor |
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