|
MC74ACT10DTR2 |
MC74ACT10MEL |
MC74ACT10DR2 |
MC74AC10NG |
MC74ACT10NG |
MC74AC10D |
Description |
Logic Gates 5V Triple 3-Input |
Logic Gates 5V Triple 3-Input |
Logic Gates 5V Triple 3-Input |
Logic Gates 2-6V Triple 3-Input NAND |
Logic Gates 5V Triple 3-Input NAND |
Logic Gates 2-6V Triple 3-Input |
Is it Rohs certified? |
conform to |
conform to |
incompatible |
conform to |
conform to |
incompatible |
Parts packaging code |
TSSOP |
SOIC |
SOIC |
DIP |
DIP |
SOIC |
package instruction |
LEAD FREE, TSSOP-14 |
SOP, SOP14,.3 |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
Contacts |
14 |
14 |
14 |
14 |
14 |
14 |
Reach Compliance Code |
unknown |
unknown |
not_compliant |
unknown |
unknown |
not_compliant |
series |
ACT |
ACT |
ACT |
AC |
ACT |
AC |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDIP-T14 |
R-PDIP-T14 |
R-PDSO-G14 |
JESD-609 code |
e4 |
e4 |
e0 |
e3 |
e3 |
e0 |
length |
5 mm |
10.2 mm |
8.65 mm |
18.86 mm |
18.86 mm |
8.65 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.012 A |
0.024 A |
0.012 A |
Number of functions |
3 |
3 |
3 |
3 |
3 |
3 |
Number of entries |
3 |
3 |
3 |
3 |
3 |
3 |
Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
SOP |
DIP |
DIP |
SOP |
Encapsulate equivalent code |
TSSOP14,.25 |
SOP14,.3 |
SOP14,.25 |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
240 |
260 |
260 |
240 |
power supply |
5 V |
5 V |
5 V |
3.3/5 V |
5 V |
3.3/5 V |
Prop。Delay @ Nom-Sup |
10 ns |
10 ns |
10 ns |
10.5 ns |
10 ns |
10.5 ns |
propagation delay (tpd) |
10 ns |
10 ns |
10 ns |
10.5 ns |
10 ns |
10.5 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
NO |
Maximum seat height |
1.2 mm |
2.05 mm |
1.75 mm |
4.69 mm |
4.69 mm |
1.75 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
6 V |
5.5 V |
6 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
2 V |
4.5 V |
2 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
NO |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn/Pb) |
Tin (Sn) |
Tin (Sn) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
0.65 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
NOT SPECIFIED |
30 |
40 |
40 |
30 |
width |
4.4 mm |
5.275 mm |
3.9 mm |
7.62 mm |
7.62 mm |
3.9 mm |
Maker |
ON Semiconductor |
ON Semiconductor |
- |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |