21499 datasheet, PDF - EEWORLD Datasheet

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21499: DescriptionSolder NC258-SN63-45-C7 700 GRAM CARTRIDGE; CategoryTools and equipment; File Size293KB，3 Pages; ManufacturerAIM - American Iron and Metal

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21499 Overview

Solder NC258-SN63-45-C7 700 GRAM CARTRIDGE

21499 Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	AIM - American Iron and Metal
Product Category	Solder
RoHS	N
Product	Solder
Type	Paste, No Clean

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NC258

Sn62 and Sn63

No Clean Solder Paste

Features:

- Long Pause-to-Print Capabilities

- Excellent Wetting, Even Leadless Devices

- Enhances Fine Print Definitions

- Reduced Voiding

- No Head-in-Pillow

Description:

NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces

such defects as voiding and eliminates head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and

shiny solder joints. It also offers very low post process residues, which remain crystal clear after soldering.

Printing:

Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16

mm (½ to ⅝ inch) is normally sufficient to begin).

Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and

workable properties.

NC258 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance

product performance and reliability.

Cleaning of your stencil will vary by application; however, it can be accomplished using AIM DJAW-10 stencil

cleaner.

RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN

PARAMETER

RECOMMENDED INITIAL SETTINGS

PARAMETER

RECOMMENDED INITIAL SETTINGS

Squeegee Pressure

Squeegee Speed

Snap-off Distance

0.9 - 1.5 lbs/inch of blade

0.5 - 6 inches/second

On Contact 0.00 mm (0.00”)

PCB Separation

Distance

PCB Separation Speed

0.75 - 2.0 mm (.030 - .080”)

3.0 - 20.00 mm/second

Reflow Profile:

Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and they

each have similar reflow temperatures. The two profiles differ in where they reach their respective peak temperatures, as

well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller assemblies, where as the longer

profile would apply to larger assemblies, such as backplanes or high-density boards. The shaded area defines the process

window. Oven efficiency, board size/mass, component type and density all influence the final profile for a given assembly.

These profiles are starting points, and processing boards with thermal-couples attached is recommended to optimize the

process.

21499 Related Products

	21499	21212	21105	21286	NC254-SN63-25-SC10	21218	21275
Description	Solder NC258-SN63-45-C7 700 GRAM CARTRIDGE	Solder NC258-SN63-45-CA9 900 GRAM CARTRIDGE	Solder NC258-SN63-38-C7 700 GRAM CARTRIDGE	Solder NC258-SN63-45-SC10 35 GRAM SYRINGE	Solder SOLDER PASTE NO CLEAN TYPE 5	Solder NC258-SN63-45-J25 250 GRAM JAR	Solder NC258-SN63-45-J5 500 GRAM JAR
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
Manufacturer	AIM - American Iron and Metal	AIM - American Iron and Metal	AIM - American Iron and Metal	AIM - American Iron and Metal	AIM - American Iron and Metal	AIM - American Iron and Metal	AIM - American Iron and Metal
Product Category	Solder	Solder	Solder	Solder	Solder	Solder	Solder
RoHS	N	N	N	N	N	N	N
Product	Solder	Solder	Solder	Solder	Solder	Solder	Solder
Type	Paste, No Clean	Paste, No Clean	Paste, No Clean	Paste, No Clean	Paste, No Clean	Paste, No Clean	Paste, No Clean

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