|
DA82562EX |
DA82562ET |
82562ET |
Description |
82562ET 10/100 Mbps Platform LAN Connect (PLC) |
82562ET 10/100 Mbps Platform LAN Connect (PLC) |
82562ET 10/100 Mbps Platform LAN Connect (PLC) |
Maker |
Intel |
Intel |
Intel |
package instruction |
BGA, BGA196,14X14,40 |
SSOP-48 |
SSOP-48 |
Reach Compliance Code |
compli |
unknown |
compliant |
JESD-30 code |
S-PBGA-B196 |
R-PDSO-G48 |
R-PDSO-G48 |
Number of terminals |
196 |
48 |
48 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
SSOP |
SSOP |
Package shape |
SQUARE |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
Terminal form |
BALL |
GULL WING |
GULL WING |
Terminal pitch |
1 mm |
0.635 mm |
0.635 mm |
Terminal location |
BOTTOM |
DUAL |
DUAL |
Parts packaging code |
- |
SSOP |
SSOP |
Contacts |
- |
48 |
48 |
length |
- |
15.85 mm |
15.85 mm |
Number of functions |
- |
1 |
1 |
Maximum operating temperature |
- |
85 °C |
85 °C |
Maximum seat height |
- |
2.74 mm |
2.74 mm |
Telecom integrated circuit types |
- |
INTERFACE CIRCUIT |
INTERFACE CIRCUIT |
Temperature level |
- |
OTHER |
OTHER |
width |
- |
7.5 mm |
7.5 mm |
Base Number Matches |
- |
1 |
1 |