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723623L15PF

Description
FIFO 256 X 36 X 2 FIFO
Categorystorage    storage   
File Size450KB,28 Pages
ManufacturerIDT (Integrated Device Technology)
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723623L15PF Overview

FIFO 256 X 36 X 2 FIFO

723623L15PF Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instructionTQFP-128
Contacts128
Manufacturer packaging codePK128
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time10 ns
Other featuresMAIL BOX
Maximum clock frequency (fCLK)66.7 MHz
period time15 ns
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
memory density9216 bit
Memory IC TypeOTHER FIFO
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256X36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP128,.63X.87,20
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1

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Description FIFO 256 X 36 X 2 FIFO FIFO 256 X 36 FIFO 8KX36K2 BUS BIDIRECTIONAL FIFO 512 x 36 SyncFIFO 5.0V FIFO 1K x 36 SyncFiFo 5.0V 18bit 83MHz FIFO 8KX36K2 BUS BIDIRECTIONAL
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Contains lead Lead free Lead free Lead free Lead free
Is it Rohs certified? incompatible incompatible conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code TQFP TQFP TQFP TQFP TQFP TQFP
package instruction TQFP-128 TQFP-128 LFQFP, LFQFP, QFP128,.63X.87,20 LFQFP, LFQFP, QFP128,.63X.87,20
Contacts 128 128 128 128 128 128
Manufacturer packaging code PK128 PK128 PK128 PKG128 PKG128 PK128
Reach Compliance Code not_compliant not_compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 10 ns 8 ns 8 ns 8 ns 8 ns 8 ns
Other features MAIL BOX MAIL BOX MAIL BOX MAIL BOX MAIL BOX MAIL BOX
period time 15 ns 12 ns 12 ns 12 ns 12 ns 12 ns
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609 code e0 e0 e3 e3 e3 e3
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 9216 bit 9216 bit 9216 bit 18432 bit 36864 bit 9216 bit
memory width 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 128 128 128 128 128 128
word count 256 words 256 words 256 words 512 words 1024 words 256 words
character code 256 256 256 512 1000 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256X36 256X36 256X36 512X36 1KX36 256X36
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 225 260 260 260 260
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) Matte Tin (Sn) - annealed Matte Tin (Sn) Matte Tin (Sn) - annealed
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED 30
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maximum clock frequency (fCLK) 66.7 MHz 83 MHz - 83 MHz - 83 MHz
Memory IC Type OTHER FIFO OTHER FIFO - OTHER FIFO - OTHER FIFO
Encapsulate equivalent code QFP128,.63X.87,20 QFP128,.63X.87,20 - QFP128,.63X.87,20 - QFP128,.63X.87,20
power supply 5 V 5 V - 5 V - 5 V
Certification status Not Qualified Not Qualified - Not Qualified - Not Qualified
Base Number Matches 1 - 1 - 1 1
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