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723633L12PFG

Description
FIFO 512 x 36 SyncFIFO 5.0V
Categorystorage    storage   
File Size450KB,28 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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723633L12PFG Overview

FIFO 512 x 36 SyncFIFO 5.0V

723633L12PFG Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instructionLFQFP, QFP128,.63X.87,20
Contacts128
Manufacturer packaging codePKG128
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionTQFP 14.0 X 20.0 X 1.4 MM
Maximum access time8 ns
Other featuresMAIL BOX
Maximum clock frequency (fCLK)83 MHz
period time12 ns
JESD-30 codeR-PQFP-G128
JESD-609 codee3
length20 mm
memory density18432 bit
Memory IC TypeOTHER FIFO
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals128
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X36
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP128,.63X.87,20
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.001 A
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width14 mm

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Description FIFO 512 x 36 SyncFIFO 5.0V FIFO 256 X 36 FIFO 8KX36K2 BUS BIDIRECTIONAL FIFO 1K x 36 SyncFiFo 5.0V 18bit 83MHz FIFO 8KX36K2 BUS BIDIRECTIONAL FIFO 256 X 36 X 2 FIFO
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Contains lead Lead free Lead free Lead free Contains lead
Is it Rohs certified? conform to incompatible conform to conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code TQFP TQFP TQFP TQFP TQFP TQFP
package instruction LFQFP, QFP128,.63X.87,20 TQFP-128 LFQFP, LFQFP, LFQFP, QFP128,.63X.87,20 TQFP-128
Contacts 128 128 128 128 128 128
Manufacturer packaging code PKG128 PK128 PK128 PKG128 PK128 PK128
Reach Compliance Code compliant not_compliant compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 8 ns 8 ns 8 ns 8 ns 8 ns 10 ns
Other features MAIL BOX MAIL BOX MAIL BOX MAIL BOX MAIL BOX MAIL BOX
period time 12 ns 12 ns 12 ns 12 ns 12 ns 15 ns
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609 code e3 e0 e3 e3 e3 e0
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 18432 bit 9216 bit 9216 bit 36864 bit 9216 bit 9216 bit
memory width 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1
Number of terminals 128 128 128 128 128 128
word count 512 words 256 words 256 words 1024 words 256 words 256 words
character code 512 256 256 1000 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512X36 256X36 256X36 1KX36 256X36 256X36
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 225 260 260 260 225
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maximum clock frequency (fCLK) 83 MHz 83 MHz - - 83 MHz 66.7 MHz
Memory IC Type OTHER FIFO OTHER FIFO - - OTHER FIFO OTHER FIFO
Encapsulate equivalent code QFP128,.63X.87,20 QFP128,.63X.87,20 - - QFP128,.63X.87,20 QFP128,.63X.87,20
power supply 5 V 5 V - - 5 V 5 V
Certification status Not Qualified Not Qualified - - Not Qualified Not Qualified
Base Number Matches - - 1 1 1 1

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