FIFO 8KX36K2 BUS BIDIRECTIONAL
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | TQFP |
| package instruction | LFQFP, |
| Contacts | 128 |
| Manufacturer packaging code | PK128 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 11321984 |
| Samacsys Pin Count | 128 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Quad Flat Packages |
| Samacsys Footprint Name | 723623L12PFG |
| Samacsys Released Date | 2020-01-24 08:08:06 |
| Is Samacsys | N |
| Maximum access time | 8 ns |
| Other features | MAIL BOX |
| period time | 12 ns |
| JESD-30 code | R-PQFP-G128 |
| JESD-609 code | e3 |
| length | 20 mm |
| memory density | 9216 bit |
| memory width | 36 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 128 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X36 |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Maximum seat height | 1.6 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
| Base Number Matches | 1 |
| 723623L12PFG8 | 723623L12PF8 | 723633L12PFG | 723643L12PFG8 | 723623L12PFG | 723623L15PF | |
|---|---|---|---|---|---|---|
| Description | FIFO 8KX36K2 BUS BIDIRECTIONAL | FIFO 256 X 36 | FIFO 512 x 36 SyncFIFO 5.0V | FIFO 1K x 36 SyncFiFo 5.0V 18bit 83MHz | FIFO 8KX36K2 BUS BIDIRECTIONAL | FIFO 256 X 36 X 2 FIFO |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Is it lead-free? | Lead free | Contains lead | Lead free | Lead free | Lead free | Contains lead |
| Is it Rohs certified? | conform to | incompatible | conform to | conform to | conform to | incompatible |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP |
| package instruction | LFQFP, | TQFP-128 | LFQFP, QFP128,.63X.87,20 | LFQFP, | LFQFP, QFP128,.63X.87,20 | TQFP-128 |
| Contacts | 128 | 128 | 128 | 128 | 128 | 128 |
| Manufacturer packaging code | PK128 | PK128 | PKG128 | PKG128 | PK128 | PK128 |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns | 10 ns |
| Other features | MAIL BOX | MAIL BOX | MAIL BOX | MAIL BOX | MAIL BOX | MAIL BOX |
| period time | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns | 15 ns |
| JESD-30 code | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
| JESD-609 code | e3 | e0 | e3 | e3 | e3 | e0 |
| length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| memory density | 9216 bit | 9216 bit | 18432 bit | 36864 bit | 9216 bit | 9216 bit |
| memory width | 36 | 36 | 36 | 36 | 36 | 36 |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 128 | 128 | 128 | 128 | 128 | 128 |
| word count | 256 words | 256 words | 512 words | 1024 words | 256 words | 256 words |
| character code | 256 | 256 | 512 | 1000 | 256 | 256 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256X36 | 256X36 | 512X36 | 1KX36 | 256X36 | 256X36 |
| Exportable | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 225 | 260 | 260 | 260 | 225 |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED |
| width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 |
| Maximum clock frequency (fCLK) | - | 83 MHz | 83 MHz | - | 83 MHz | 66.7 MHz |
| Memory IC Type | - | OTHER FIFO | OTHER FIFO | - | OTHER FIFO | OTHER FIFO |
| Encapsulate equivalent code | - | QFP128,.63X.87,20 | QFP128,.63X.87,20 | - | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
| power supply | - | 5 V | 5 V | - | 5 V | 5 V |
| Certification status | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
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