EPF10K100ABC356-3 datasheet, PDF

EPF10K100ABC356-3: DescriptionFPGA - Field Programmable Gate Array FPGA - Flex 10K 624 LABs 274 IOs; CategoryProgrammable logic devices Programmable logic; File Size2MB，128 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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FPGA - Field Programmable Gate Array FPGA - Flex 10K 624 LABs 274 IOs

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	LBGA, BGA356,26X26,50
Reach Compliance Code	compliant
ECCN code	3A991
JESD-30 code	S-PBGA-B356
JESD-609 code	e0
length	35 mm
Humidity sensitivity level	3
Dedicated input times	4
Number of I/O lines	274
Number of entries	274
Number of logical units	4992
Output times	274
Number of terminals	356
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4 DEDICATED INPUTS, 274 I/O
Output function	REGISTERED
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA356,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	220
power supply	2.5/3.3,3.3 V
Programmable logic type	LOADABLE PLD
propagation delay	0.8 ns
Certification status	Not Qualified
Maximum seat height	1.63 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	35 mm

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