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89010

Description
Solder WS483-SN63-45-J25 250 GRAM JAR
CategoryTools and equipment   
File Size202KB,3 Pages
ManufacturerAIM - American Iron and Metal
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89010 Overview

Solder WS483-SN63-45-J25 250 GRAM JAR

89010 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerAIM - American Iron and Metal
Product CategorySolder
RoHSN
ProductSolder
TypePaste, Water Soluble
Factory Pack Quantity10
WS483
Sn62 and Sn63
Water Soluble Solder Paste
Features:
- 48 Hour Stencil Life
- Excellent Activity
- 24 Hour Tack Time
- Excellent Printing Characteristics
- Slump Resistant
- Good for Batch or Continuous Runs
- Extended Cleaning Window
- High-Humidity Resistant
- Will Not Foam During Wash
Description:
WS483 is an organically activated formulation developed to better resist the effects of increased humidity
levels. WS483 offers improved heat and humidity resistance, while maintaining high tack and resistance to
slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the
cleaning process, even in high-pressure wash systems.
Printing:
-
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of
12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
-
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry
and workable properties.
-
WS483 provides the necessary tack time and force for today’s high speed placement equipment, which
will enhance product performance and reliability.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
Squeegee Pressure
Squeegee Speed
Snap-off Distance
RECOMMENDED INITIAL SETTINGS
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
12-150 mm/sec (.5-6”/sec)
On Contact 0.00 mm (0.00”)
PARAMETER
PCB Separation Distance
PCB Separation Speed
RECOMMENDED INITIAL SETTINGS
0.75-2.0 mm (.030-.080”)
Slow
Reflow Profile:
Either a straight ramp-spike or ramp-soak-spike profile can be used as shown below. Both profiles would
have a similar peak temperature and time above liquidus (TAL). The shaded area defines the process window.
Oven efficiency, board size/mass, component type and density all influence the final profile for a given
assembly. These profiles are starting points, and processing boards with thermal-couples attached is
recommended to optimize the process.
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