Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit)
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | BGA |
| package instruction | 0.75 MM PITCH, FBGA-48 |
| Contacts | 48 |
| Reach Compliance Code | unknow |
| ECCN code | 3A991 |
| Maximum access time | 55 ns |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B48 |
| JESD-609 code | e0 |
| memory density | 16777216 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 48 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1MX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA48,6X8,30 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.000008 A |
| Minimum standby current | 1.5 V |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.75 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| R1LV1616HBG-5SI | R1LV1616HBG-4SI | R1LV1616HBG-I | |
|---|---|---|---|
| Description | Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) |
| Parts packaging code | BGA | BGA | - |
| package instruction | 0.75 MM PITCH, FBGA-48 | BGA, BGA48,6X8,30 | - |
| Contacts | 48 | 48 | - |
| Reach Compliance Code | unknow | compli | - |
| ECCN code | 3A991 | 3A991.B.2.A | - |
| Maximum access time | 55 ns | 45 ns | - |
| I/O type | COMMON | COMMON | - |
| JESD-30 code | R-PBGA-B48 | R-PBGA-B48 | - |
| memory density | 16777216 bi | 16777216 bi | - |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | - |
| memory width | 16 | 16 | - |
| Number of functions | 1 | 1 | - |
| Number of terminals | 48 | 48 | - |
| word count | 1048576 words | 1048576 words | - |
| character code | 1000000 | 1000000 | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | 85 °C | 85 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | - |
| organize | 1MX16 | 1MX16 | - |
| Output characteristics | 3-STATE | 3-STATE | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | BGA | BGA | - |
| Encapsulate equivalent code | BGA48,6X8,30 | BGA48,6X8,30 | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | GRID ARRAY | GRID ARRAY | - |
| Parallel/Serial | PARALLEL | PARALLEL | - |
| power supply | 3/3.3 V | 3/3.3 V | - |
| Certification status | Not Qualified | Not Qualified | - |
| Maximum standby current | 0.000008 A | 0.000008 A | - |
| Minimum standby current | 1.5 V | 1.5 V | - |
| Maximum slew rate | 0.05 mA | 0.05 mA | - |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | - |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | - |
| Nominal supply voltage (Vsup) | 3 V | 3 V | - |
| surface mount | YES | YES | - |
| technology | CMOS | CMOS | - |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - |
| Terminal form | BALL | BALL | - |
| Terminal pitch | 0.75 mm | 0.75 mm | - |
| Terminal location | BOTTOM | BOTTOM | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD