|
R1LV1616HBG-4SI |
R1LV1616HBG-I |
R1LV1616HBG-5SI |
Description |
Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) |
Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) |
Wide Temperature Range Version 16 M SRAM (1-Mword 】 16-bit) |
Parts packaging code |
BGA |
- |
BGA |
package instruction |
BGA, BGA48,6X8,30 |
- |
0.75 MM PITCH, FBGA-48 |
Contacts |
48 |
- |
48 |
Reach Compliance Code |
compli |
- |
unknow |
ECCN code |
3A991.B.2.A |
- |
3A991 |
Maximum access time |
45 ns |
- |
55 ns |
I/O type |
COMMON |
- |
COMMON |
JESD-30 code |
R-PBGA-B48 |
- |
R-PBGA-B48 |
memory density |
16777216 bi |
- |
16777216 bi |
Memory IC Type |
STANDARD SRAM |
- |
STANDARD SRAM |
memory width |
16 |
- |
16 |
Number of functions |
1 |
- |
1 |
Number of terminals |
48 |
- |
48 |
word count |
1048576 words |
- |
1048576 words |
character code |
1000000 |
- |
1000000 |
Operating mode |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
- |
85 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
organize |
1MX16 |
- |
1MX16 |
Output characteristics |
3-STATE |
- |
3-STATE |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
BGA |
- |
BGA |
Encapsulate equivalent code |
BGA48,6X8,30 |
- |
BGA48,6X8,30 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
GRID ARRAY |
- |
GRID ARRAY |
Parallel/Serial |
PARALLEL |
- |
PARALLEL |
power supply |
3/3.3 V |
- |
3/3.3 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Maximum standby current |
0.000008 A |
- |
0.000008 A |
Minimum standby current |
1.5 V |
- |
1.5 V |
Maximum slew rate |
0.05 mA |
- |
0.05 mA |
Maximum supply voltage (Vsup) |
3.6 V |
- |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
- |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
- |
3 V |
surface mount |
YES |
- |
YES |
technology |
CMOS |
- |
CMOS |
Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
Terminal form |
BALL |
- |
BALL |
Terminal pitch |
0.75 mm |
- |
0.75 mm |
Terminal location |
BOTTOM |
- |
BOTTOM |